NB7L572MNR4G ON Semiconductor, NB7L572MNR4G Datasheet - Page 6

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NB7L572MNR4G

Manufacturer Part Number
NB7L572MNR4G
Description
IC CLK/DATA FANOUT/XLATOR 32QFN
Manufacturer
ON Semiconductor
Series
GigaComm™r
Type
Multiplexer , Translatorr
Datasheet

Specifications of NB7L572MNR4G

Number Of Circuits
1
Ratio - Input:output
4:2
Differential - Input:output
Yes/Yes
Input
CML, LVDS, LVPECL
Output
LVPECL
Frequency - Max
8GHz
Voltage - Supply
2.375 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-TFQFN Exposed Pad
Frequency-max
8GHz
Number Of Clock Inputs
4
Mode Of Operation
Differential
Output Frequency
7000MHz
Output Logic Level
LVPECL
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Signal Type
CML/LVDS/LVPECL
Mounting
Surface Mount
Pin Count
32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NB7L572MNR4G
Manufacturer:
ON
Quantity:
5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
11. Measured using a 100 mVpk−pk source, 50% duty cycle clock source. All output loading with external 50 W to V
12. Output voltage swing is a single−ended measurement operating in differential mode.
13. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when
14. Additive RMS jitter with 50% duty cycle clock signal.
15. Additive Peak−to−Peak data dependent jitter with input NRZ data at K28.5.
16. Input voltage swing is a single−ended measurement operating in differential mode.
Table 6. AC CHARACTERISTICS
f
f
V
t
t
t
t
t
t
V
t
MAX
DATAMAX
PLH
PHL
PD Tempco
skew
DC
JITTER
r,
Symbol
OUTPP
INPP
, t
rates 40 ps (20% − 80%).
the delays are measured from cross−point of the inputs to the cross−point of the outputs.
f
,
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
800
750
700
650
600
0
(V
Maximum Input Clock Frequency V
Maximum Operating Data Rate NRZ, (PRBS23)
Output Voltage Amplitude (@ V
(Note 12)
Propagation Delay to Differential Outputs
Measured at Differential Cross−Point
Differential Propagation Delay Temperature Coefficient
Output – Output skew (within device) (Note 13)
Device – Device skew (tpd max – tpd min)
Output Clock Duty Cycle (Reference Duty Cycle = 50%)
Additive Random Clock Jitter, RJ(RMS) (Note 14)
Data Dependent Jitter, DDJ (Note 15)
Input Voltage Swing (Differential Configuration) (Note 16)
Output Rise/Fall Times @ 1 GHz; (20% − 80%), V
OUTPP
Figure 2. CLOCK Output Voltage Amplitude
1
fin, CLOCK INPUT FREQUENCY (GHz)
) / RMS Jitter vs. Input Frequency (f
Ambient Temperature (typical)
2
3
V
4
CC
= 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 11)
INPPmin
5
OUT
Characteristic
) (Figure 2 & 9)
w 400 mV
6
http://onsemi.com
7
@ 1 GHz INx/INx to Qx/Qx (Figure 9)
@ 50 MHz SELx to Qx (Figure 10)
IN
in
) at
= 800 mV Q, Q
6
8
f
f
in
in
v 10 Gbps
v 7.0 GHz
f
f
in
in
≤ 5 GHz
≤ 7 GHz
V
INx
INx
Tx
50 W
50 W
Figure 3. Input Structure
Min
550
400
125
300
100
10
45
25
7
V
CC
Typ
750
500
150
115
0.5
50
45
11
8
0
6
CC
− 2 V. Input edge
1000
1200
Max
175
0.8
10
50
55
15
65
ps pk−pk
ps rms
Gbps
fs/°C
Unit
GHz
mV
mV
ps
ps
ps
%

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