MC100LVEP111FAG ON Semiconductor, MC100LVEP111FAG Datasheet - Page 13

• Manufacturer Part Number: MC100LVEP111FAG
• Description: IC CLOCK DRIVER DIFF 1:10 32LQFP
• Manufacturer: ON Semiconductor
• Series: 100LVEPr
• Type: Fanout Buffer (Distribution), Multiplexerr

Specifications of MC100LVEP111FAG

• Number Of Circuits: 1
• Ratio - Input:output: 2:10
• Differential - Input:output: Yes/Yes
• Input: ECL, HSTL, LVDS, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 3GHz
• Output Logic Level: ECL, PECL
• Supply Voltage (max): +/- 3.8 V
• Supply Voltage (min): +/- 2.375 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Multiply / Divide Factor: 2:1
• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: 3000MHz
• Operating Supply Voltage (min): -2.375/2.375V
• Operating Supply Voltage (typ): -2.5/-3.3/2.5/3.3V
• Operating Supply Voltage (max): -3.8/3.8V
• Package Type: LQFP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Signal Type: ECL/HSTL/PECL
• Mounting: Surface Mount
• Pin Count: 32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC100LVEP111FAGOS

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32 X
2 X
2 X
LOCATION
0.15 C
0.10 C
0.08 C
PIN ONE
0.15 C
32 X
L
32 X
0.10
0.05 C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
É É
É É
8
1
C
BOTTOM VIEW
32
9
A
SIDE VIEW
TOP VIEW
B
D2
D
16
25
A1
17
(A3)
24
e
E
EXPOSED PAD
E2
A
B
32 X
K
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USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
A
QFN32 5*5*1 0.5 P
http://onsemi.com
CASE 488AM−01
C
SEATING
PLANE
ISSUE O
*For additional information on our Pb−Free strategy and soldering
13
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.63
32 X
0.28
32 X
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
K
L
e
3.20
5.30
0.800
0.000
0.180
2.950
2.950
0.200
0.300
MIN
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MILLIMETERS
0.500 BSC
0.200 REF
5.00 BSC
5.00 BSC
DIMENSIONS: MILLIMETERS
NOM
0.900
0.025
0.250
3.100
3.100
0.400
−−−
1.000
0.050
0.300
3.250
3.250
0.500
MAX
−−−
0.50 PITCH
28 X
3.20
MC100LVEP111/D
5.30