MC100EP210SMNG ON Semiconductor, MC100EP210SMNG Datasheet - Page 6

• Manufacturer Part Number: MC100EP210SMNG
• Description: IC CLOCK DRIVER LVDS DUAL 32-QFN
• Manufacturer: ON Semiconductor
• Series: 100EPr
• Type: Fanout Buffer (Distribution)r

Specifications of MC100EP210SMNG

• Number Of Circuits: 2
• Ratio - Input:output: 1:5
• Differential - Input:output: Yes/Yes
• Input: LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 1GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TFQFN Exposed Pad
• Frequency-max: 1GHz
• Number Of Outputs: 20
• Operating Supply Voltage (max): 2.625V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.675ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 32
• Operating Supply Voltage (typ): 2.5V
• Package Type: QFN EP
• Input Frequency: >1000MHz
• Operating Temperature Classification: Industrial
• Clock Ic Type: Clock Driver
• Frequency: 1GHz
• No. Of Outputs: 5
• Ic Output Type: LVDS
• Supply Current: 150mA
• Supply Voltage Range: 2.375V To 2.625V
• Digital Ic Case Style: QFN
• No. Of Pins: 32
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SEATING
PLANE
9
B
−AB−
−AC−
B1
−T−
8
1
32
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DATUM PLANE −AB− IS LOCATED AT
4. DATUMS −T−, −U−, AND −Z− TO BE
5. DIMENSIONS S AND V TO BE
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE
8. MINIMUM SOLDER PLATE THICKNESS
9. EXACT SHAPE OF EACH CORNER MAY
PER ANSI Y14.5M, 1982.
MILLIMETER.
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE −AB−.
DETERMINED AT SEATING PLANE −AC−.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −AB−.
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
SHALL BE 0.0076 (0.0003).
VARY FROM DEPICTION.
−Z−
25
4X
17
4X
0.20 (0.008)
−U−
0.20 (0.008)
V1
PACKAGE DIMENSIONS
DETAIL AD
V
http://onsemi.com
MC100EP210S
AB
32 LEAD LQFP
CASE 873A−02
AC
T−U
ISSUE B
T−U
6
Z
C
Z
E
P
H
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
8X
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1
12 REF
_
M_
_
W
DETAIL AD
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
DETAIL Y
_
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
12 REF
1
INCHES
_
_
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
X
5
_
AE
AE
K
R
Q_
SECTION AE−AE
É É
É É
É É
F
METAL
BASE
J
N
D