MC100ES6210FA Freescale Semiconductor, MC100ES6210FA Datasheet - Page 3

• Manufacturer Part Number: MC100ES6210FA
• Description: IC FANOUT BUFFER LV 1:5 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 100ESr
• Type: Fanout Buffer (Distribution)r

Specifications of MC100ES6210FA

• Number Of Circuits: 2
• Ratio - Input:output: 1:5
• Differential - Input:output: Yes/Yes
• Input: ECL, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 3GHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Advanced Clock Drivers Devices
Freescale Semiconductor
Table 3. General Specifications
Table 4. PECL DC Characteristics (V
Clock Input Pair CLKA, CLKA, CLKB, CLKB (PECL differential signals)
PECL Clock Outputs (QA0-4, QA0-4, QB0-4, QB0-4)
Supply Current and V
1. Output termination voltage V
2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according
1. V
2. V
3. Equivalent to a termination of 50 Ω to V
Symbol
Symbol
HBM
CDM
V
MM
C
θ
θ
V
LU
to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are
specified up to 110°C junction temperature allowing the MC100ES6210 to be used in applications requiring industrial temperature range. It
is recommended that users of the MC100ES6210 employ thermal modeling analysis to assist in applying the junction temperature
specifications to their particular application.
range and the input swing lies within the V
T
V
V
V
V
JA
JC
I
TT
CMR
IN
I
J
EE
PP
CMR
PP
IN
OH
OL
BB
(DC) is the minimum differential input voltage swing required to maintain device functionality.
(DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the V
Output Termination Voltage
ESD Protection (Machine Model)
ESD Protection (Human Body Model)
ESD Protection (Charged Device Model)
Latch-Up Immunity
Input Capacitance
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Operating Junction Temperature
(continuous operation)
Differential Input Voltage
Differential Cross Point Voltage
Input Current
Output High Voltage
Output Low Voltage
Maximum Quiescent Supply Current
without Output Termination Current
Output Reference Voltage
BB
JESD 51-6, 2S2P multilayer test board
Characteristics
(1)
JESD 51-3, single layer test board
Characteristics
TT
= 0 V for V
(1)
V
V
CC
CC
CC
TT
(2)
= 3.3 V
= 2.5 V
MTBF = 9.1 years
.
(2)
CC
PP
= 2.5 V ± 5% or V
= 2.5 V operation is supported but the power consumption of the device will increase.
(DC) specification.
±
±
5%
5%
V
V
V
V
CC
CC
CC
CC
Min
0.1
1.0
–1.38
–1.2
–1.9
–1.9
CC
2000
Min
200
200
= 3.3 V ± 5%, V
V
V
V
V
CC
CC
CC
CC
Typ
–1.005
–1.705
–1.705
60
V
–1.26
CC
83.1
73.3
68.9
63.8
57.4
59.0
54.4
52.5
50.4
47.8
23.0
Typ
4.0
– 2
(1)
EE
V
V
= GND, T
V
V
V
CC
CC
CC
CC
CC
±100
Max
100
1.3
–1.14
– 0.3
–0.7
–1.5
–1.3
Max
86.0
75.4
70.9
65.3
59.6
60.6
55.7
53.8
51.5
48.8
26.3
110
J
= 0°C to +110°C)
Unit
mA
µA
V
V
V
V
V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
pF
°C
V
V
V
V
Differential operation
Differential operation
V
I
I
V
I
OH
OL
BB
IN
EE
Inputs
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
MIL-SPEC 883E
Method 1012.1
= –5 mA
= 0.2 mA
= V
= –30 mA
pin
Condition
IL
Condition
MC100ES6210
or V
(3)
CMR
IN
(3)
= V
(DC)
IH
3