PCF8591P,112 NXP Semiconductors, PCF8591P,112 Datasheet - Page 2

• Manufacturer Part Number: PCF8591P,112
• Description: IC ADC/DAC 8-BIT I2C 16-DIP
• Manufacturer: NXP Semiconductors
• Type: ADC, DACr

Specifications of PCF8591P,112

• Package / Case: 16-DIP (0.300", 7.62mm)
• Resolution (bits): 8 b
• Sampling Rate (per Second): 11.1k
• Data Interface: I²C, Serial
• Voltage Supply Source: Dual ±
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Resolution: 8 bit
• Interface Type: I2C
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2.5 V
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1087-5; 933768130112; PCF8591PN

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
2003 Jan 27
8-bit A/D and D/A converter
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Addressing
Control byte
D/A conversion
A/D conversion
Reference voltage
Oscillator
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
I
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
D/A CHARACTERISTICS
A/D CHARACTERISTICS
AC CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-bus protocol
2
C COMPONENTS
2
C-BUS
2
Product specification
PCF8591