RGEF500K TE Connectivity, RGEF500K Datasheet - Page 16

• Manufacturer Part Number: RGEF500K
• Description: FUSE, PTC RESET, 16V, 5A, RADIAL
• Manufacturer: TE Connectivity
• Series: RGEFr

Specifications of RGEF500K

• Holding Current: 5A
• Tripping Current: 8.5A
• Initial Resistance Max: 0.024ohm
• Operating Voltage: 16V
• Ptc Fuse Case: Radial Leaded
• Initial Resistance Min: 0.015ohm
• Rohs Compliant: Yes
• Ul File Number: E74889
• Csa File Number: 78165C
• Vmax Operating (v): 16
• Vmax (v): 16
• Imax (a): 100
• Ih (room Temperature) (a): 5
• It (room Temperature) (a): 8.50
• Rmin (?): 0.015
• Rmax (?): 0.023
• R1 Max [post Trip] (?): 0.034
• Power Dissipation (typical) (w): 2.60
• Construction: Radial, Through Hole
• Lead Type: Standard Kinked Lead
• Family Name: RGEF
• Coating: Coated
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Tuv Certificate No.: R72041433
• Operating Temperature (max.) (°c): 85
• Application: Radial
• Packaging Method: Bulk
• Lead Free Status / Rohs Status: Compliant

13
125
Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
LVR/LVRL
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Devices are not designed to be placed through a reflow process.
LVR/LVRL
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
BBRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Devices are not designed to be placed through a reflow process.
BBRF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RXEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Devices are not designed to be placed through a reflow process.
RXEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
LVR005-016: Tin-plated copper, 0.205mm
LVR025-040: Tin-plated copper, 0.32mm
LVR055: Tin-plated copper, 0.52mm
LVRL: Tin-plated copper, 0.52mm
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Tin-plated copper, 0.52mm
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b, can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
RXEF005: Tin-plated nickel-copper ally, 0.128mm
RXEF010: Tin-plated nickel-copper ally, 0.205mm
RXEF017 to 040: Tin-plated copper-clad steel, 0.205mm
RXEF050 to 090: Tin-plated copper, 0.205mm
RXEF110 to 375: Tin-plated copper, 0.52mm
Solderability pre ANSI/J-STD-002 Category 3
RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1
RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 5 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
-40°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
2
(20AWG), ø0.81mm (0.032in.)
2
(20AWG), ø0.81mm (0.032in.)
2
(20AWG), ø0.81mm (0.032in.)
2
2
(22AWG), ø0.64mm (0.025in.)
(24AWG), ø0.51mm (0.020in.)
2
2
(20AWG), ø0.81mm (0.032in.)
(24AWG), ø0.51mm (0.020in.)
2
2
(26AWG), ø0.40mm (0.016in.)
(24AWG), ø0.51mm (0.020in.)
2
(24AWG), ø0.51mm (0.020in.)
Resistance Change
±5%
±5%
±5%
±5%
No change
Resistance Change
±5%
±5%
±5%
±5%
No change
Resistance Change
±5%
±5%
±10%
±10%
No change