2013499-1 TE Connectivity, 2013499-1 Datasheet - Page 5

MICRO USB REC TYPE B DIP ASSY(AU)

2013499-1

Manufacturer Part Number
2013499-1
Description
MICRO USB REC TYPE B DIP ASSY(AU)
Manufacturer
TE Connectivity
Series
Br
Datasheets

Specifications of 2013499-1

Size
Micro
Gender
Receptacle
Number Of Ports
1
Orientation
Right Angle
Mount Location
Top
Termination Method
Surface Mount
Locking Feature
Without
Led
Without
Panel Ground
Without
Pcb Mount Retention Type
Straight Leg
Shell Plating
Matte Tin
Assembly Process Feature
Without Pick and Place Cover
Locating Post(s)
Without
Number Of Positions
5
Contact Termination Type
Surface Mount
Contact Plating, Mating Area, Material
Gold
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Housing Color
Black
Industry Standard
USB 2.0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Usb-if Test Id Number (tid)
61001336
Applies To
Printed Circuit Board
Pcb Thickness, Recommended (mm [in])
1.00 [0.039]
Packaging Method
Tape & Reel
3.5.12
3.5.12
3.5.13
3.5.13
3.5.14
3.5.14
3.5.15
3.5.15
Rev G
Para.
項目
耐熱性
Temperature Life
熱衝撃
Thermal Shock
温湿度サイクル
Humidity – Temperature
Cycling
ガス耐久性
Mixed Flowing Gas
Test Items
試験項目
外観に異常なきこと。
Product Specification
製品規格
後のテストの必要条件に合致
すること。
外観に異常なきこと。
後のテストの必要条件に合致
すること。
No physical damage and
shall meet requirement of
subsequent test.
外観に異常なきこと。
後のテストの必要条件に合致
すること。
No physical damage and
shall meet requirement of
subsequent test.
外観に異常なきこと。
No physical damage and
shall meet requirements of
subsequent tests.
No physical damage.
Fig. 1 (終り) Fig. 1 (End.)
Environmental Requirements
Requirements
環 境 的 性 能
嵌合したコネクタ
+85℃
+85℃ for 500 hours mated.
嵌合したコネクタに対して-55℃、+85℃それ
ぞれ15分ずつかける。これを1サイクルとし
て、10サイクル行う。
EIA 364-32 Test Condition I
-55℃,+85℃, 15 minutes at each
temperature , and 10 cycles , mated.
EIA 364-32 Test Condition I
嵌合したコネクタを湿度95% 25℃、65℃の
条件に7サイクル放置。
EIA 364-31 Test Condition A Method Ⅲ
25℃ and 65℃ at 95% RH, seven cycles ,
mated.
EIA 364-31 Test Condition A Method Ⅲ
コネクタをEIA 364-65 ClassⅡAの条件に合
計10日間放置する
5日間(嵌合なし)
5日間(嵌合あり)
(ClassⅡA: RH% 70±2, Temp℃ 30±1, Cl
10±3ppb, NO
SO
EIA 364-65 ClassⅡA for total 10 days.
5days(unmated)
5days(mated)
(ClassⅡA: RH% 70±2, Temp℃ 30±1, Cl
10±3ppb, NO
SO
2
2
100±20ppb)
100±20ppb)
500時間放置。
2
2
200±50ppb, H
200±50ppb, H
Procedures
108-78434
2
2
S 10±5 ppb,
S 10±5 ppb,
5 of 7
2
2

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