IDTSTAC9272X5TAEB4X IDT, Integrated Device Technology Inc, IDTSTAC9272X5TAEB4X Datasheet - Page 225

• Manufacturer Part Number: IDTSTAC9272X5TAEB4X
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDTSTAC9272X5TAEB4X

• Single Supply Voltage (typ): 3.3V
• Single Supply Voltage (min): 3.135V
• Single Supply Voltage (max): 3.465V
• Package Type: TQFP
• Lead Free Status / Rohs Status: Compliant

10. SOLDER REFLOW PROFILE
IDT™
STAC9271/9274
10-CHANNEL HIGH DEFINITION AUDIO CODEC
Time maintained above
10.1. Standard Reflow Profile Data
Note: All temperatures refer to topside of the package, measured on the package body surface.
Time within 5
10-CHANNEL HIGH DEFINITION AUDIO CODEC
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Peak / Classification Temperature (Tp)
Preheat
Average Ramp-Up Rate (Ts
Profile Feature
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
- ts
Figure 6. Reflow Profile
- Tp)
max
max
min
L
L
IDT CONFIDENTIAL
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 226.
20 - 40 seconds
6
8 minutes max
o
C for 3 to 5 seconds.
o
o
C / second max
C / second max
225
o
o
o
C
C
C
Pb Free Assembly
STAC9271/9274
PC AUDIO
V 1.1 01/08