FWIXC1100BD Intel, FWIXC1100BD Datasheet - Page 62

• Manufacturer Part Number: FWIXC1100BD
• Manufacturer: Intel

Specifications of FWIXC1100BD

• Core Operating Frequency: 533MHz
• Package Type: BGA
• Pin Count: 492
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

6.2.1
Figure 24.
Figure 25.
Intel
Hardware Design Guidelines
62
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
General Component Spacing
Good Design Practice for VIA Hole Placement
Figure 24
surface-mount boards.
Figure 26
components and PGA or BGA components.
Poor Design Practice for VIA Placement
• Maintain a minimum of component pad spacing of 100 mils for auto-insertion
• Do not place any components within 125 mils of the printed circuit board edge. This
• The minimum spacing between the via and the solder pad is 25 mils.
equipment for mixed assemblies.
is required to bed-of-nails test fixture.
Intel
®
and
shows minimum pad-to-pad clearance for surface-mount passive
IXP42X product line and IXC1100 control plane processors—General Layout and Routing
25 mils min
Figure 25
25 mils min
show good and poor design practices for via placement on
Flush Via min
25 mils min
Potential Bridge min
Document Number: 252817-008US
B2267-01
December 2007
B2266-01
Guide