EXB28V560JX Panasonic, EXB28V560JX Datasheet - Page 5

• Manufacturer Part Number: EXB28V560JX
• Description: THICK FILM CHIP 4R ARRAY CONVEX 0804 5%
• Manufacturer: Panasonic

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1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and eval u ate the op er a tions
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
● Flow soldering
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
and/or reliability.
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
protective coatings and bodies may be chipped, affecting their performance.
Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for refl ow
· Refl ow soldering shall be performed a maximum of
· Please contact us for additional information when
· Please measure the temperature of the terminals
Safety Precautions
Type
N8V
two times.
used in conditions other than those specifi ed.
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
· We do not recommend fl ow soldering, because a solder bridge may form.
28V
f
0.45 to 0.50 0.35 to 0.38
a
0.40
a
Preheating
b
0.525
b
d
Peak
c
Time
Dimensions
d
c
0.25
0.25
c
d
b
Heating
0.25
0.25
d
(Not to scale)
Unit (mm)
1.40 to 2.00
1.40
f
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Type
Preheating
Main heating
Peak
Preheating
Main heating
Peak
2HV
f
a
b
1.00
a
d
c
140 °C to 160 °C
150 °C to 180 °C
d
Above 200 °C
Above 230 °C
0.425
Temperature
Temperature
max. 260 °C
c
235 ± 5 °C
b
d
c
Dimensions
d
c
0.25
Chip Resistor Array
c
d
c
d
c
60 s to 120 s
60 s to 120 s
0.25
30 s to 40 s
30 s to 40 s
max. 10 s
d
max. 10 s
d
(Not to scale)
Time
Time
b
Unit (mm)
2.00
Feb. 2006
f