XC2V500-4FGG256C Xilinx Inc, XC2V500-4FGG256C Datasheet - Page 211

• Manufacturer Part Number: XC2V500-4FGG256C
• Description: IC VIRTEX-II FPGA 500K 256-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-IIr

Specifications of XC2V500-4FGG256C

• Number Of Labs/clbs: 768
• Total Ram Bits: 589824
• Number Of I /o: 172
• Number Of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -
• Other names: 122-1356

R
Virtex-II Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
FF1152 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
12, XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Virtex-II devices are available in the FF1152
flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the pin differences in the XC2V3000
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DS031-4 (v3.5) November 5, 2007
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Product Specification
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