EP3C120F484I7 Altera, EP3C120F484I7 Datasheet - Page 8

IC CYCLONE III FPGA 120K 484FBGA

EP3C120F484I7

Manufacturer Part Number
EP3C120F484I7
Description
IC CYCLONE III FPGA 120K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C120F484I7

Number Of Logic Elements/cells
119088
Number Of Labs/clbs
7443
Total Ram Bits
3981312
Number Of I /o
283
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
119088
# I/os (max)
283
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
119088
Ram Bits
3981312
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
For Use With
544-2589 - KIT DEV EMB CYCLONE III EDITION544-2566 - KIT DEV DSP CYCLONE III EDITION544-2444 - KIT DEV CYCLONE III EP3C120
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C120F484I7
Manufacturer:
ALTERA
Quantity:
3 000
Part Number:
EP3C120F484I7
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C120F484I7
Manufacturer:
ALTERA
0
Part Number:
EP3C120F484I7
Manufacturer:
ALTERA
Quantity:
150
Part Number:
EP3C120F484I7
Manufacturer:
ALTERA
Quantity:
20 000
Part Number:
EP3C120F484I7N
Manufacturer:
DALLAS
Quantity:
101
Part Number:
EP3C120F484I7N
Manufacturer:
ALTERA
Quantity:
561
Part Number:
EP3C120F484I7N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C120F484I7N
Manufacturer:
ALTERA
0
Part Number:
EP3C120F484I7N
Manufacturer:
ALTERA
Quantity:
150
Part Number:
EP3C120F484I7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Part Number:
EP3C120F484I7N
0
Part Number:
EP3C120F484I7N WWW.YIBEIIC.COM
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
1–8
I/O Features
High-Speed Differential Interfaces
Auto-Calibrating External Memory Interfaces
Cyclone III Device Handbook, Volume 1
f
f
f
Cyclone III device family has eight I/O banks. All I/O banks support single-ended
and differential I/O standards listed in
Table 1–6. Cyclone III Device Family I/O Standards Support
The Cyclone III device family I/O also supports programmable bus hold,
programmable pull-up resistors, programmable delay, programmable drive strength,
programmable slew-rate control to optimize signal integrity, and hot socketing.
Cyclone III device family supports calibrated on-chip series termination (R
driver impedance matching (Rs) for single-ended I/O standards, with one OCT
calibration block per side.
For more information, refer to the
Cyclone III device family supports high-speed differential interfaces such as BLVDS,
LVDS, mini-LVDS, RSDS, and PPDS. These high-speed I/O standards in Cyclone III
device family provide high data throughput using a relatively small number of I/O
pins and are ideal for low-cost applications. Dedicated differential output drivers on
the left and right I/O banks can send data rates at up to 875 Mbps for Cyclone III
devices and up to 740 Mbps for Cyclone III LS devices, without the need for external
resistors. This saves board space or simplifies PCB routing. Top and bottom I/O banks
support differential transmission (with the addition of an external resistor network)
data rates at up to 640 Mbps for both Cyclone III and Cyclone III LS devices.
For more information, refer to the
chapter.
Cyclone III device family supports common memory types such as DDR, DDR2,
SDR SDRAM, and QDRII SRAM. DDR2 SDRAM memory interfaces support data
rates up to 400 Mbps for Cyclone III devices and 333 Mbps for Cyclone III LS devices.
Memory interfaces are supported on all sides of Cyclone III device family. Cyclone III
device family has the OCT, DDR output registers, and 8-to-36-bit programmable DQ
group widths features to enable rapid and robust implementation of different
memory standards.
An auto-calibrating megafunction is available in the Quartus II software for DDR and
QDR memory interface PHYs. This megafunction is optimized to take advantage of
the Cyclone III device family I/O structure, simplify timing closure requirements, and
take advantage of the Cyclone III device family PLL dynamic reconfiguration feature
to calibrate PVT changes.
For more information, refer to the
chapter.
Single-Ended I/O
Differential I/O
Type
LVTTL, LVCMOS, SSTL, HSTL, PCI, and PCI-X
SSTL, HSTL, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS
High-Speed Differential Interfaces in Cyclone III Devices
Cyclone III Device I/O Features
External Memory Interfaces in Cyclone III Devices
Table
1–6.
I/O Standard
Chapter 1: Cyclone III Device Family Overview
© December 2009 Altera Corporation
Cyclone III Device Family Architecture
chapter.
S
OCT) or

Related parts for EP3C120F484I7