CY8C20646A-24LTXI Cypress Semiconductor Corp, CY8C20646A-24LTXI Datasheet - Page 34

• Manufacturer Part Number: CY8C20646A-24LTXI
• Description: MCU 16K FLASH 2K SRAM 48VQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: CapSense® Controllersr

Specifications of CY8C20646A-24LTXI

• Program Memory Type: FLASH (16 kB)
• Package / Case: 48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
• Applications: Capacitive Sensing
• Core Processor: M8C
• Controller Series: CY8C20xx6A
• Ram Size: 2K x 8
• Interface: I²C, SPI, USB
• Number Of I /o: 36
• Voltage - Supply: 1.71 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Processor Series: CY8C20x46A
• Core: M8C
• Data Ram Size: 2 KB
• Interface Type: I2C, SPI
• Maximum Clock Frequency: 400 KHz
• Number Of Programmable I/os: 36
• Number Of Timers: 3
• Operating Supply Voltage: 1.71 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: CY3280-20X66
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 16 KB
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: QFN EP
• Pin Count: 48
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
• Lead Free Status / Rohs Status: Compliant

Thermal Impedances
Table 36. Thermal Impedances per Package
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 37. Solder Reflow Peak Temperature
Document Number: 001-54459 Rev. **
Notes
12. T
13. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
14. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
24 QFN
32 QFN
48 QFN
48 SSOP
Package
48 SSOP
Package
16 QFN
24 QFN
32 QFN
48 QFN
16 QFN
JA
.
[13]
[13]
[13]
Minimum Peak Temperature
Typical θ
32.69
20.90
19.51
17.68
69
240
240
240
220
240
o
C/W
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C/W
C/W
C/W
C/W
JA
[12]
[14]
CY8C20X36A/46A/66A/96A
Maximum Peak Temperature
o
C with Sn-Pb or 245 ± 5
260
260
260
260
260
o
o
o
o
o
C
C
C
C
C
o
C with Sn-Ag-Cu paste.
Page 34 of 38
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