MPC8245LVV333D Freescale Semiconductor, MPC8245LVV333D Datasheet - Page 51

IC MPU 32BIT 333MHZ PPC 352-TBGA

MPC8245LVV333D

Manufacturer Part Number
MPC8245LVV333D
Description
IC MPU 32BIT 333MHZ PPC 352-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of MPC8245LVV333D

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
333MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
333 MHz
Operating Supply Voltage
2 V, 2.1 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
333MHz
Embedded Interface Type
I2C, UART
Digital Ic Case Style
TBGA
No. Of Pins
352
Supply Voltage Range
1.9V To 2.2V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8245LVV333D
Manufacturer:
Maxim
Quantity:
52
Part Number:
MPC8245LVV333D
Manufacturer:
FREESCAL
Quantity:
1 045
Part Number:
MPC8245LVV333D
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8245LVV333D
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MPC8245LVV333D
0
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
18
16
14
12
10
8
6
4
2
0
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 28. Die Junction-to-Ambient Resistance
0.5
Airflow Velocity (m/s)
1
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
1.5
603-224-9988
408-749-7601
800-522-6752
2
2.5
System Design
51

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