MPC8245LVV350D Freescale Semiconductor, MPC8245LVV350D Datasheet - Page 51

IC MPU 32BIT 350MHZ PPC 352-TBGA

MPC8245LVV350D

Manufacturer Part Number
MPC8245LVV350D
Description
IC MPU 32BIT 350MHZ PPC 352-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerPCr
Datasheet

Specifications of MPC8245LVV350D

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
350MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Processor Series
MPC8xxx
Core
603e
Maximum Clock Frequency
350 MHz
Operating Supply Voltage
2 V, 2.1 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
350MHz
Digital Ic Case Style
BGA
No. Of Pins
352
Supply Voltage Range
1.9V To 2.2V
Operating Temperature Range
0°C To +105°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8245LVV350D
Manufacturer:
MOTOROLA
Quantity:
885
Part Number:
MPC8245LVV350D
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8245LVV350D
Manufacturer:
FREESCALE
Quantity:
20 000
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
18
16
14
12
10
8
6
4
2
0
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 28. Die Junction-to-Ambient Resistance
0.5
Airflow Velocity (m/s)
1
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
1.5
603-224-9988
408-749-7601
800-522-6752
2
2.5
System Design
51

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