D10650-40T1 Wakefield Thermal Solutions, D10650-40T1 Datasheet - Page 9

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D10650-40T1

Manufacturer Part Number
D10650-40T1
Description
Heatsinks 84-100 PQFP/169 BGA W/T405 CHOMERIC TAPE
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of D10650-40T1

Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Plastic
Fin Style
Pin
Dimensions
16.5 mm L x 16.5 mm W x 10.2 mm H
Designed For
BGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500

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