MPC8347CVRAGDB Freescale Semiconductor, MPC8347CVRAGDB Datasheet - Page 55

IC MPU POWERQUICC II 620-PBGA

MPC8347CVRAGDB

Manufacturer Part Number
MPC8347CVRAGDB
Description
IC MPU POWERQUICC II 620-PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8347CVRAGDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
620-PBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
400MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
BGA
No. Of Pins
672
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

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18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8347E is available in
two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See
“Package Parameters for the MPC8347E TBGA,” Section 18.2, “Mechanical Dimensions for the
MPC8347E TBGA,Section 18.3, “Package Parameters for the MPC8347E PBGA,”
“Mechanical Dimensions for the MPC8347E PBGA.”
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8347E TBGA
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
35 mm × 35 mm
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
and
Package and Pin Listings
Section 18.1,
Section 18.4,
55

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