MPC862PCZQ80B Freescale Semiconductor, MPC862PCZQ80B Datasheet - Page 10

• Manufacturer Part Number: MPC862PCZQ80B
• Description: IC MPU PWRQUICC 80MHZ 357-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC862PCZQ80B

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 80MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 80MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: -40C to 115C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Thermal Characteristics
4
Table 3
5
Table 4
and 2:1 mode, where CPU frequency is twice bus speed.
10
Thermal Characteristics
Power Dissipation
1
2
3
4
5
6
shows the thermal characteristics for the MPC862/857T/857DSL.
provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,
Junction to ambient
Junction to board
Junction to case
Junction to package top
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
is measured on the top surface of the board near the package.
plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case
thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.
junction temperature per JEDEC JESD51-2.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
Indicates the average thermal resistance between the die and the case top surface as measured by the cold
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal characterization parameter indicating the temperature difference between package top and the
Rating
MPC862/857T/857DSL PowerQUICC™ Family Hardware Specifications, Rev. 3
5
4
Die Revision
(1:1 Mode)
(1:1 Mode)
1
Table 3. MPC862/857T/857DSL Thermal Resistance Data
A.1, B.0
6
0
Natural Convection
Air flow (200 ft/min)
Natural Convection
Air flow (200 ft/min)
Table 4. Power Dissipation (P
Frequency
50 MHz
66 MHz
50 MHz
66 MHz
Environment
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Typical
TBD
656
630
890
1
D
Maximum
)
1000
TBD
735
760
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
Ψ
θJA
2
θJB
θJC
JT
JT
2
3
3
3
Unit
mW
mW
mW
mW
Value
Freescale Semiconductor
37
23
30
19
13
6
2
2
°C/W
Unit