MC68040RC33V Freescale Semiconductor, MC68040RC33V Datasheet - Page 349

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MC68040RC33V

Manufacturer Part Number
MC68040RC33V
Description
IC MICROPROCESSOR 32BIT PGA-182
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68040RC33V

Processor Type
M680x0 32-Bit
Speed
33MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
179-PGA
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
33MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
182
Package Type
PGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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In the specification provided by Thermalloy, Inc., a chart illustrates the heat-sink
temperature rise above ambient versus heat dissipated. This chart applies if no airflow is
used with the heat-sink. Table 11-5 lists the calculations based on this chart.
MOTOROLA
MHz
25
25
25
33
33
33
20
25
33
Table 11-5. Thermal Parameters with Heat Sink and No Airflow
Airflow Velocity
Thermal Mgmt.
Technique
0
0
0
0
0
0
0
0
0
Figure 11-11. Heat Sink with Attachment
Freescale Semiconductor, Inc.
For More Information On This Product,
10.0 W
6.3 W
6.6 W
8.6 W
7.7 W
8.0 W
4.0 W
5.0 W
6.3 W
P
Go to: www.freescale.com
MC68LC040 and MC68EC040
M68040 USER’S MANUAL
D
Defined Parameters
110 C
110 C
110 C
110 C
110 C
110 C
110 C
110 C
110 C
MC68040
T
J
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
JC
Heat-Sink
64.4 C
66.8 C
82.8 C
75.6 C
78.0 C
94.0 C
45.0 C
54.0 C
64.4 C
T
Spec.
C
–T
A
SPRING
HEAT SINK
PIN GRID
ARRAY
FRAME
91.1 C
90.2 C
84.2 C
86.9 C
86.0 C
80.0 C
98.0 C
95.0 C
91.1 C
T
Calculated
C
–14.0 C
26.7 C
23.4 C
11.3 C
53.0 C
41.0 C
26.7 C
1.4 C
8.0 C
T
A
11-21

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