MPC8313EVRAFFB Freescale Semiconductor, MPC8313EVRAFFB Datasheet - Page 51

• Manufacturer Part Number: MPC8313EVRAFFB
• Description: IC MPU POWERQUICC II PRO 516PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8313EVRAFFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 333MHz
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8313E-RDB
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 16 KB
• I/o Voltage: 2.5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Program Memory Type: EEPROM/Flash
• For Use With: MPC8313E-RDB - BOARD PROCESSOR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

12 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG)
interface.
12.1
Table 47
12.2
This section describes the AC electrical specifications for the IEEE Std 1149.1 (JTAG) interface.
Table 48
Freescale Semiconductor
At recommended operating conditions (see
Input high voltage
Input low voltage
Input current
Output high voltage
Output low voltage
Output low voltage
JTAG external clock frequency of operation
JTAG external clock cycle time
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
Input setup times:
Input hold times:
Valid times:
provides the DC electrical characteristics for the IEEE Std 1149.1 (JTAG) interface.
provides the JTAG AC timing specifications as defined in
JTAG DC Electrical Characteristics
JTAG AC Timing Specifications
Characteristic
Table 48. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)
MPC8313E PowerQUICC
Parameter
Table 47. JTAG Interface DC Electrical Characteristics
Boundary-scan data
Boundary-scan data
Boundary-scan data
Table
2).
™
TMS, TDI
TMS, TDI
II Pro Processor Hardware Specifications, Rev. 3
Symbol
V
V
V
TDO
V
V
I
IN
OH
OL
OL
IH
IL
t
JTGR
Symbol
t
t
t
t
t
t
t
JTDVKH
JTDXKH
JTKHKL
JTKLDV
JTKLOV
t
JTIVKH
JTIXKH
t
TRST
f
I
JTG
OH
I
JTG
I
& t
OL
OL
Condition
JTGF
= –8.0 mA
= 3.2 mA
= 8.0 mA
2
—
—
—
Min
Figure 41
30
15
25
10
10
0
0
4
4
2
2
–0.3
Min
2.1
2.4
—
—
—
through
Max
33.3
11
11
—
—
—
—
—
—
—
2
NV
Figure
DD
1
Max
0.8
0.5
0.4
±5
—
MHz
+ 0.3
Unit
ns
ns
ns
ns
ns
ns
ns
45.
Notes
Unit
μA
V
V
V
V
V
4
4
5
3
JTAG
51