TDA8002CG/C1,518 NXP Semiconductors, TDA8002CG/C1,518 Datasheet - Page 24

• Manufacturer Part Number: TDA8002CG/C1,518
• Description: IC INTERFACE CARD 32-LQFP
• Manufacturer: NXP Semiconductors

Specifications of TDA8002CG/C1,518

• Package / Case: 32-LQFP
• Controller Type: Smart Card Interface
• Interface: Analog
• Voltage - Supply: 3 V ~ 6.5 V
• Current - Supply: 140mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3518-2; 935261709518; TDA8002CGB-T

Philips Semiconductors
PACKAGE OUTLINES
1999 Oct 12
SO28: plastic small outline package; 28 leads; body width 7.5 mm
IC card interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT136-1
28
1
Z
max.
0.10
2.65
y
A
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E06
IEC
0.01
0.25
A
3
e
0.019
0.014
0.49
0.36
b
D
p
MS-013AE
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
18.1
17.7
0.71
0.69
D
(1)
0.30
0.29
E
7.6
7.4
(1)
b
p
scale
0.050
EIAJ
1.27
24
5
e
15
14
w
0.419
0.394
10.65
10.00
H
M
E
c
0.055
1.4
L
A
10 mm
2
0.043
0.016
A
1.1
0.4
L
1
p
0.043
0.039
1.1
1.0
Q
H
E
PROJECTION
E
detail X
EUROPEAN
0.25
0.01
v
L
L
0.25
0.01
p
Q
w
(A )
Product specification
3
0.004
TDA8002C
0.1
y
A
ISSUE DATE
95-01-24
97-05-22
A
0.035
0.016
Z
0.9
0.4
(1)
X
SOT136-1
v
M
8
0
A
o
o