MAX1954AEUB Maxim Integrated Products, MAX1954AEUB Datasheet - Page 16

• Manufacturer Part Number: MAX1954AEUB
• Description: Current Mode PWM Controllers
• Manufacturer: Maxim Integrated Products

Specifications of MAX1954AEUB

• Number Of Outputs: 1
• Duty Cycle (max): 93 %
• Output Voltage: 0.8 V to 4.95 V
• Output Current: 25000 mA
• Mounting Style: SMD/SMT
• Package / Case: uSOP-10
• Switching Frequency: 360 KHz
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Synchronous Pin: No
• Topology: Boost, Buck
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
The error-amplifier gain at f
R
C
See Table 2 for suggested manufacturers of the com-
ponents used with the MAX1954A.
Careful PC board layout is critical to achieve low
switching losses and clean, stable operation. The
switching power stage requires particular attention.
Follow these guidelines for good PC board layout:
1) Place IC decoupling capacitors as close as possible
Table 2. Suggested Manufacturers
16
C
C
Central Semiconductor
Coilcraft
Fairchild
Kemet
Panasonic
Taiyo Yuden
TOKO
is then calculated as:
and C
to IC pins. Keep separate the power-ground plane
(connected to pin 7) and the signal-ground plane
(connected to pin 4). The IN pin has two decoupling
capacitors. One connects to pin 7 and one connects
to pin 4.
______________________________________________________________________________________
MANUFACTURER
R
C
f
C
C
can then be calculated as:
C
f
G
V
EA fC
V
OUT
2
Applications Information
FB
R
( )
LOAD
R
LOAD
PC Board Layout Guidelines
R
C
g
g
1
mEA
mEA
f
f
S
C
zMOD
f
S
is:
R
f
zMOD
C
L
L
f
C
f
COMPONENT
zMOD
C
f
C
OUT
Capacitors
Capacitors
Capacitors
R
MOSFETs
Inductors
Inductors
G
Diodes
C
MOD fC
( )
2) Place the MOSFETs’ decoupling capacitors as
3) Input and output capacitors are connected to the
4) Keep the high-current paths as short as possible.
5) Connect the drain leads of the power MOSFET to a
6) Connect HSD directly to the drain leads of the high-
7) Connect LX directly to the drain of the low-side
8) Place the low-side MOSFET so that its source is as
9) Ensure all feedback connections are short and
10) Route high-speed switching nodes away from sen-
11)The trace length from the gates of the low-side and
To aid design, a sample layout is available in the
MAX1954A evaluation kit.
close as possible and place them directly across
from the high-side MOSFET drain and the low-side
MOSFET source.
power-ground plane; all other capacitors are con-
nected to the signal-ground plane.
large copper area to help cool the device. Refer to
the power MOSFET data sheet for recommended
copper area.
side MOSFET.
MOSFET.
close as possible to pin 7.
direct. Place the feedback resistors as close as
possible to the IC.
sitive analog areas (FB, COMP).
high-side MOSFETs to DH and DL should be no
longer than 700 mils.
631-435-1110
800-322-2645
800-341-0392
864-963-6300
714-373-7366
408-573-4150
800-745-8656
PHONE
www.centralsemi.com
www.coilcraft.com
www.fairchildsemi.com
www.kemet.com
www.panasonic.com
www.t-yuden.com
www.toko.com
WEBSITE