MAX863EEE Maxim Integrated Products, MAX863EEE Datasheet - Page 14

• Manufacturer Part Number: MAX863EEE
• Description: DC/DC Switching Controllers Dual PFM Step-Up DC/DC Controller
• Manufacturer: Maxim Integrated Products

Specifications of MAX863EEE

• Number Of Outputs: 2
• Output Voltage: 3.15 V to 3.45 V
• Input Voltage: 1.5 V to 11 V
• Mounting Style: SMD/SMT
• Package / Case: QSOP-16
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C

External voltage feedback to the MAX863 should be
compensated for stray capacitance and EMI in the
feedback network. Proper compensation is achieved
when the MAX863 switches evenly, rather than in wide-
ly spaced bursts of pulses with large output ripple.
Typically, lead compensation consisting of a 10pF to
220pF ceramic capacitor (C1 in Figure 7) across the
upper feedback resistor is adequate. Circuits with
V
capacitor across the lower feedback resistor. Initially,
choose this capacitor so that R2C2 = R1C1. Set the
final values of the compensation capacitors based on
empirical analysis of a prototype.
High switching speeds and large peak currents make
PC board layout an important part of design. Poor lay-
out can cause excessive EMI and ground-bounce, both
of which can cause instability or regulation errors by
Dual, High-Efficiency, PFM, Step-Up
DC-DC Controller
Figure 8. Bootstrapped 3.3V Logic and 24V LCD Bias Supply
14
OUT
______________________________________________________________________________________
or V
DD
≤0.1Ω
220µF
V
greater than 7.5V may require a second
10V
OUT1
C1
V
PC Board Layout and Routing
IN
Set Feedback Compensation
= 5V
= 1.8V TO V
R5
R6
OUT1
C2
0.1µF
100k
R7
LOW-BATTERY
DETECTOR OUTPUT
MBRS340T3
D1
N1A
L1
10µH
2A
R1
50mΩ
SENSE1
≤0.1Ω
CS1
LBI
100µF
EXT1
LBO
FB1
10V
C3
PGND
MAX863
V
corrupting the voltage and current-feedback signals.
Place power components as close together as possi-
ble, and keep their traces short, direct, and wide. Keep
the extra copper on the board and integrate it into
ground as an additional plane. On multi-layer boards,
avoid interconnecting the ground pins of the power
components using vias through an internal ground
plane. Instead, place the ground pins of the power
components close together and route them in a “star”
ground configuration using component-side copper,
then connect the star ground to the internal ground
plane using multiple vias.
The current-sense resistor and voltage-feedback net-
works should be very close to the MAX863. Noisy
traces, such as from the EXT pins, should be kept away
from the voltage-feedback networks and isolated from
them using grounded copper. Consult the MAX863
evaluation kit manual for a full PC board example.
DD
GND
SHDN1
SHDN2
≤0.1Ω
100µF
BOOT
EXT2
CS2
REF
FB2
10V
C4
100mΩ
R2
ON/OFF
N1B
IRF7103
L2
10µH
1A
C7
0.1µF
MBRS140
D2
909k
49.9k
1%
1%
R3
R4
V
OUT2
= 24V, 35mA
C6
15pF
C8
270pF
C5
22µF
35V
0.1Ω