595D226X0050R2T Sprague / Vishay, 595D226X0050R2T Datasheet - Page 9

• Manufacturer Part Number: 595D226X0050R2T
• Description: Capacitor, Tantalum; 22uF; Chip; +/-20%; Case R; SMD; 50WVDC; 65V; 0.39Ohms ESR; 11muA; 6
• Manufacturer: Sprague / Vishay

Specifications of 595D226X0050R2T

• Capacitance: 22 μF
• Case Code: R
• Case Size: 7257
• Current, Dc Leakage: 11 μA
• Dimensions: 0.283 in. L (Max.) x 0.235 in. ± 0.012 in. W x 0.136 in. ± 0.012 in. H
• Dissipation Factor: 6% (Max.) @ 120 Hz, +25°C
• Esr: 0.39 Ohms
• Esr, Test Condition: @ +25°C, 100 kHz
• Material, Element: Tantalum
• Standards: EIA 535BAAC and CECC30801
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Tolerance: ±20 %
• Voltage, Rating: 50 VDC
• Voltage, Surge: 65 VDC
• Terminations: 100% Tin (2) Standard
• Capacitance Range: 0.1 μF to 1500 μF
• Lead Free Status / Rohs Status: RoHS Compliant part

595D
Vishay Sprague
www.vishay.com
64
4.0
5.0
GUIDE TO APPLICATION (Continued)
6.0
7.0 Printed Circuit Board Material: The capacitors are
8.
8.1 Solder Paste: The recommended thickness of the
8.2 Soldering: Capacitors can be attached by
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating at + 25°C and 5% of the
DC rating at + 85°C.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25°C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25°C
temperature rise.)
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there, please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
Attachment:
solder paste after applications is .007" ± .001"
[1.78mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
conventional soldering techniques, vapor phase
convection, infrared reflow wave soldering and hot
plate methods. The Soldering Profile charts show typical
recomendedtime/temperature conditions for soldering.
Preheating is recommended. The recommended
maximum ramp rate is 2°C per second.
Code
Case
Temperature
M
G
T
S
A
B
C
D
H
R
+ 125°C
+ 25°C
+ 85°C
Maximum Permissible
Power Dissipation
@ + 25
in free air
For technical questions, contact [e-mail]
0.030
0.060
0.075
0.085
0.095
0.110
0.150
0.115
0.125
0.250
°
C (Watts)
Derating
Factor
1.0
0.9
0.4
RECOMMENDED REFLOW SOLDERING PROFILE
Attachment with a soldering iron is not recommended
due to the difficulty of controlling temperature and time
at temperature. The soldering iron must never come
in contact with the capacitor.
25
25
25
Recommended Pb Free Reflow Soldering Profile
Recommended Pb Free Reflow Soldering Profile
°
°
Recommended SnPb Reflow Soldering Profile
°
C
C
C
200
150
200
150
150
100
245
260
225
Large Case Codes: A, B, C, T, G, H, M, S
°
°
°
°
°
°
C
C
°
C
C
C
C
°
°
C
C
C
217
217
183
Large Case Codes: D, R
60 - 150 sec
60 - 150 sec
°
TIME (seconds)
TIME (seconds)
TIME (seconds)
°
°
60 - 90 sec
C
C
C
Preheat
Preheat
Preheat
All Case Codes
Document Number 40007
60 sec
60 sec
60 sec
10 sec
10 sec
10 sec
Revision 07-Mar-05