MCP1603T-330I/OS Microchip Technology Inc., MCP1603T-330I/OS Datasheet - Page 2

• Manufacturer Part Number: MCP1603T-330I/OS
• Description: Regulator, Sync-Buck, 2.7-5.5V In, 3.3V 0.5A Out, TSOT-5
• Manufacturer: Microchip Technology Inc.
• Type: Regulatorr

Specifications of MCP1603T-330I/OS

• Current, Input Bias: 0.1 nA
• Current, Output: 500 mA
• Current, Supply: 45 μA
• Frequency, Oscillator: 2 MHz
• Package Type: OS
• Regulation, Line: 0.3 %/V
• Regulation, Load: 0.35 %
• Regulator Type: Buck
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Input: 5.5 V
• Voltage, Output: 3.3 V
• Dc: 04+
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

MCP1603
1.0
Absolute Maximum Ratings †
V
All Other I/O ...............................(GND - 0.3V) to (V
L
Output Short Circuit Current..................................Continuous
Power Dissipation (Note 5) ..........................Internally Limited
Storage Temperature.....................................-65°C to +150°C
Ambient Temp. with Power Applied.................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
DC CHARACTERISTICS
DS22042A-page 4
Electrical Characteristics: Unless otherwise indicated, V
I
Input Characteristics
Input Voltage
Maximum Output Current
Shutdown Current
Quiescent Current
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
SHDN, Logic Input Voltage High
SHDN, Input Leakage Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis UVLO
Thermal Shutdown
Thermal Shutdown Hysteresis
Note 1:
X
OUT
IN
HBM..............................................................................4 kV
MM...............................................................................300V
to GND .............................................. -0.3V to (V
- GND.......................................................................+6.0V
= 100 mA, T
2:
3:
4:
5:
6:
ELECTRICAL
CHARACTERISTICS
Parameters
The minimum V
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
V
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. T
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the L
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
R
is the output voltage setting.
A
= +25°C. Boldface specifications apply over the T
IN
has to meet two conditions: V
T
I
I
IN_SHDN
SHD-HYS
L_SHDN
UVLO
T
Sym
I
V
OUT
V
V
SHD
I
Q
IN
IH
IL
HYS
IN
IN
+ 0.3V)
+ 0.3V)
2.12
Min
-1.0
500
2.7
45
—
—
—
—
—
—
IN
= SHDN = 3.6V, C
IN
±0.1
2.28
Typ
140
150
0.1
≥ 2.7V and V
45
10
A
—
—
—
—
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
range of -40°C to +85°C.
OUT
Max
2.43
5.5
1.0
60
15
—
—
—
—
—
1
= C
IN
A
X
≥ V
, T
IN
pin to the V
Units
= 4.7 µF, L = 4.7 µH, V
%V
%V
J
OUT
mA
mV
µA
µA
µA
, θ
°C
°C
V
V
IN
IN
JA
+ 0.5V.
). Exceeding the maximum
© 2007 Microchip Technology Inc.
Note 1
Note 1
SHDN = GND
SHDN = V
V
V
V
V
Note 4, Note 5
Note 4, Note 5
IN
IN
IN
IN
IN
= 2.7V to 5.5V
= 2.7V to 5.5V
= 2.7V to 5.5V
Falling
pin, and from the L
Conditions
IN
, I
OUT
OUT
(ADJ) = 1.8V,
= 0 mA
X
pin