25LC040-I/SN Microchip Technology Inc., 25LC040-I/SN Datasheet - Page 4

• Manufacturer Part Number: 25LC040-I/SN
• Description: 4K, 512 X 8 , 2.5V SER EE IND
• Manufacturer: Microchip Technology Inc.

Specifications of 25LC040-I/SN

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 1 mA (Read), 5 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 4K
• Interface: SPI Bus
• Memory Type: Serial EEPROM
• Organization: 512×8
• Package Type: SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Access: 230 ns
• Time, Address Hold: 250
• Time, Address Setup: 250
• Time, Fall: 2 μs
• Time, Rise: 2 μs
• Voltage, Esd: >4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, High: 2 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

25AA040/25LC040/25C040
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
DS21204E-page 14
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
§
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
MIN
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
INCHES*
NOM
8
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
4.80
0.25
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
NOM
8
© 2006 Microchip Technology Inc.
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
4
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8