ISP1102AW-T ST-Ericsson Inc, ISP1102AW-T Datasheet

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IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - NXP ...

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ISP1102A Advanced Universal Serial Bus transceiver Rev. 01 — 15 February 2007 1. General description The ISP1102A Universal Serial Bus (USB) transceiver is fully compliant with “Universal Serial Bus Specification Rev. USB data at full-speed (12 Mbit/s). The transceiver allows ...

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... Digital still camera N Personal Digital Assistant (PDA) N Information Appliance (IA) 4. Ordering information Table 1. Ordering information Type number Package Name Description ISP1102AW HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 5. Block diagram Fig 1. Block diagram ISP1102A_1 Product data sheet 3 CC(IO) VBUSDET ...

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... ISP1102A_1 Product data sheet OE_N 1 RCV 2 VP/VPO 3 ISP1102AW VM/VMO 4 SUSPEND 5 Transparent top view [2] Description input for output enable (CMOS level with respect to V the transceiver to transmit data on the USB bus input pad; push pull; CMOS differential data receiver output (CMOS level with respect to V when input SUSPEND is HIGH ...

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NXP Semiconductors Table 2. Pin description …continued [1] Symbol Pin Type CC(IO) VBUSDET AI AI VREG3V3 CC(5V0) VPU3V3 15 - ...

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NXP Semiconductors 7. Functional description 7.1 Function selection Table 3. Function selection SUSPEND OE_N DP, DM LOW LOW driving or receiving LOW HIGH receiving HIGH LOW driving [1] HIGH HIGH high-Z [1] Signal levels on the DP and DM pins ...

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NXP Semiconductors Sharing mode — this mode, the DP and DM pins are 3-stated and the ISP1102A allows external signals 3 share the DP and DM lines. The internal circuits of the ISP1102A ...

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NXP Semiconductors 7.4 Power supply input options The ISP1102A has two power supply input options. Internal regulator — Pin V used to supply the internal circuitry with 3.3 V (nominal). The VREG3V3 pin becomes a 3.3 V output reference. Regulator ...

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NXP Semiconductors 8. ElectroStatic Discharge (ESD) 8.1 ESD protection For the HBCC package, the pins that are connected to the USB connector (DP, DM, V CC(5V0) is limited by the test equipment. Capacitors of 4.7 F connected from VREG3V3 to ...

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NXP Semiconductors 9. Limiting values Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (5.0 V) CC(5V0 supply voltage CC(IO) V input voltage I I latch-up current lu ...

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NXP Semiconductors Table 11. Static characteristics: supply pins CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter I sharing mode supply current CC(IO)sharing ...

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NXP Semiconductors Table 12. Static characteristics: digital pins CC(IO) GND Symbol Parameter Capacitance C input capacitance in Example 1.8 V 0.15 V CC(IO) Input levels ...

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NXP Semiconductors Table 13. Static characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI V differential common mode CM voltage ...

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NXP Semiconductors Table 14. Dynamic characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter V output ...

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NXP Semiconductors Fig 4. Rise time and fall time 1.8 V logic 0.9 V input PZH t PZL V OH differential V CRS data ...

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NXP Semiconductors 13. Test information Fig 8. Load on pins DP and DM Fig 9. Load on pins DP and DM for enable time and disable time Fig 10. Load on pins VM/VMO, VP/VPO and RCV ISP1102A_1 Product data sheet ...

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NXP Semiconductors 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original ...

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... NXP Semiconductors 15. Packing information The ISP1102AW (HBCC16 package) is delivered on a Type A carrier tape, see The tape dimensions are given in The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 100 mm ...

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NXP Semiconductors 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There ...

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NXP Semiconductors • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is ...

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NXP Semiconductors For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 18. Acronym ASIC CMOS ESD HBM SE0 USB 18. References [1] Universal Serial Bus Specification Rev. 2.0 [2] ...

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NXP Semiconductors 20. Legal information 20.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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... Table 12. Static characteristics: digital pins . . . . . . . . . . .10 Table 13. Static characteristics: analog I/O pins DP and .12 Table 14. Dynamic characteristics: analog I/O pins DP and .12 Table 15. Type A carrier tape dimensions for the ISP1102AW . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 16. SnPb eutectic process (from J-STD-020C .19 Table 17. Lead-free process (from J-STD-020C .19 Table 18. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .20 Table 19. Revision history . . . . . . . . . . . . . . . . . . . . . . . .20 ISP1102A_1 Product data sheet Rev. 01 — ...

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NXP Semiconductors 23. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Fig 2. Pin configuration ...

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NXP Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...