ADM213ARS Analog Devices Inc, ADM213ARS Datasheet - Page 13

• Manufacturer Part Number: ADM213ARS
• Description: IC TXRX RS-232 5V 0.1UF 28SSOP
• Manufacturer: Analog Devices Inc
• Type: Transceiverr

Specifications of ADM213ARS

• Rohs Status: RoHS non-compliant
• Number Of Drivers/receivers: 4/5
• Protocol: RS232
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP

OUTLINE DIMENSIONS
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
COPLANARITY
0.30 (0.0118)
0.10 (0.0039)
0.10
(4.57)
0.180
MAX
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 26. 24-Lead Standard Small Outline Package [SOIC]
Figure 25. 24-Lead Plastic Dual In-Line Package [PDIP]
1.27 (0.0500)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
1
24
Dimensions shown in inches and (millimeters)
Dimensions shown in millimeters and (inches)
24
1
COMPLIANT TO JEDEC STANDARDS MS-013AD
BSC
COMPLIANT TO JEDEC STANDARDS MO-095AG
15.60 (0.6142)
15.20 (0.5984)
1.185 (30.01)
1.165 (29.59)
1.145 (29.08)
0.100
(2.54)
0.51 (0.020)
0.31 (0.012)
BSC
0.015 (0.38) MIN
Wide Body
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
(N-24)
(R-24)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
13
12
13
12
7.60 (0.2992)
7.40 (0.2913)
SEATING
PLANE
0.33 (0.0130)
0.20 (0.0079)
10.65 (0.4193)
10.00 (0.3937)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
8°
0°
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
Rev. C | Page 13 of 16
× 45°
0.05 MIN
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
PIN 1
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 28. 28-Lead Standard Small Outline Package [SOIC]
2.00 MAX
Figure 27. 24-Lead Shrink Small Outline Package [SSOP]
24
1
BSC
0.65
28
1
Dimensions shown in millimeters and (inches)
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013AE
COMPLIANT TO JEDEC STANDARDS MO-150AG
BSC
8.50
8.20
7.90
Dimensions shown in millimeters
18.10 (0.7126)
17.70 (0.6969)
ADM206–ADM211/ADM213
0.51 (0.0201)
0.33 (0.0130)
0.38
0.22 SEATING
1.85
1.75
1.65
13
12
Wide Body
PLANE
(RS-24)
(R-28)
SEATING
PLANE
5.60
5.30
5.00
COPLANARITY
0.10
2.65 (0.1043)
2.35 (0.0925)
15
14
0.25
0.09
8.20
7.80
7.40
7.60 (0.2992)
7.40 (0.2913)
0.33 (0.0130)
0.20 (0.0079)
10.65 (0.4193)
10.00 (0.3937)
8°
4°
0°
8°
0°
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.95
0.75
0.55
× 45°