MAX6404BS43-T Maxim Integrated Products, MAX6404BS43-T Datasheet - Page 8

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MAX6404BS43-T

Manufacturer Part Number
MAX6404BS43-T
Description
Supervisory Circuits
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6404BS43-T

Number Of Voltages Monitored
1
Monitored Voltage
1.2 V to 5.5 V
Undervoltage Threshold
4.235 V
Overvoltage Threshold
4.364 V
Output Type
Active High, Push-Pull
Manual Reset
Resettable
Watchdog
No Watchdog
Battery Backup Switching
No Backup
Power-up Reset Delay (typ)
280 ms
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1 V
Supply Current (typ)
1 uA
Maximum Power Dissipation
303 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
UCSP
Minimum Operating Temperature
- 40 C
Power Fail Detection
No
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
µP Supervisory Circuits in 4-Bump (2
Chip-Scale Package
8
Table 2. Device Marking Codes
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user’s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
MAX6400BS31-T
MAX6400BS30-T
MAX6400BS29-T
MAX6400BS28-T
MAX6400BS27-T
MAX6400BS26-T
MAX6400BS25-T
MAX6400BS24-T
MAX6400BS23-T
MAX6400BS22-T
MAX6403BS46-T
MAX6403BS45-T
MAX6403BS44-T
MAX6403BS43-T
MAX6403BS42-T
MAX6403BS41-T
MAX6403BS40-T
MAX6403BS39-T
MAX6403BS38-T
MAX6403BS37-T
MAX6403BS36-T
MAX6403BS35-T
MAX6403BS34-T
MAX6403BS33-T
_______________________________________________________________________________________
PARTS
PARTS
TOP MARK
TOP MARK
AAG
ACQ
ACO
ACN
ACM
ACH
ACG
AAH
AAD
AAC
AAB
AAA
ACS
ACR
ACP
ACK
AAJ
AAF
AAE
ACT
ACL
ACJ
UCSP Reliability
AAI
ACI
MAX6401BS31-T
MAX6401BS30-T
MAX6401BS29-T
MAX6401BS28-T
MAX6401BS27-T
MAX6401BS26-T
MAX6401BS25-T
MAX6401BS24-T
MAX6401BS23-T
MAX6401BS22-T
MAX6404BS46-T
MAX6404BS45-T
MAX6404BS44-T
MAX6404BS43-T
MAX6404BS42-T
MAX6404BS41-T
MAX6404BS40-T
MAX6404BS39-T
MAX6404BS38-T
MAX6404BS37-T
MAX6404BS36-T
MAX6404BS35-T
MAX6404BS34-T
MAX6404BS33-T
PARTS
PARTS
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note, which can be found on Maxim’s website at
www.maxim-ic.com.
TOP MARK
TOP MARK
ACW
ABQ
ABO
ABM
ADH
ADG
ADD
ADC
ACU
ABU
ABR
ABN
ADE
ADB
ADA
ACZ
ACY
ACX
ACV
ABV
ABT
ABS
ABP
ADF
MAX6402BS31-T
MAX6402BS30-T
MAX6402BS29-T
MAX6402BS28-T
MAX6402BS27-T
MAX6402BS26-T
MAX6402BS25-T
MAX6402BS24-T
MAX6402BS23-T
MAX6402BS22-T
MAX6405BS46-T
MAX6405BS45-T
MAX6405BS44-T
MAX6405BS43-T
MAX6405BS42-T
MAX6405BS41-T
MAX6405BS40-T
MAX6405BS39-T
MAX6405BS38-T
MAX6405BS37-T
MAX6405BS36-T
MAX6405BS35-T
MAX6405BS34-T
MAX6405BS33-T
PARTS
PARTS
2)
TOP MARK
TOP MARK
ABW
ADQ
ADO
ADM
ACD
ACC
ACB
ACA
ADU
ADR
ADN
ADK
ACF
ACE
ABZ
ABY
ABX
ADV
ADT
ADS
ADP
ADL
ADJ
ADI

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