TLE7269G Infineon Technologies, TLE7269G Datasheet - Page 18

• Manufacturer Part Number: TLE7269G
• Description: IC TRANSCEIVER LIN DSO-14
• Manufacturer: Infineon Technologies
• Type: Transceiverr

Specifications of TLE7269G

• Number Of Drivers/receivers: 2/2
• Protocol: LIN
• Voltage - Supply: 7 V ~ 27 V
• Mounting Type: Surface Mount
• Package / Case: DSO-14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SP000104277; TLE7269G; TLE7269GTR

4.12
The TLE7269G has one integrated over temperature sensor to protect the device against thermal overstress on
the output stage 1 and output stage 2. In case of an over temperature event, the temperature sensor will disable
both output stages (see
signaled by either the RxD pins or the TxD pins. When the junction temperature falls below the thermal shut down
level
10°C hysteresis avoids toggling during the temperature shut down.
4.13
The TLE7269G can be used for 3.3 V and 5 V microcontrollers. The inputs and the outputs are capable to operate
with both voltage levels. The logic level is defined by suppling 3.3V or 5V to the
the reference voltage from the
voltage given by
The pin EN works without the voltage on the microcontroller supply
mode to Normal Operation mode by setting EN to “High”, without supplying
4.14
The TLE7269G has a feature implemented to protect the battery from running out of charge in the case of BUS
short to GND failure.
In this failure case a normal master termination, a 1 kΩ resistor and diode between the LIN bus and the power
supply V
GND is in the range 1 kΩ. To avoid this current during a generator off state, like in a parked car, the TLE7269G
has a bus short to GND feature implemented, which is activated in Sleep mode.
This feature is only applicable, if the master termination of BUS1 is connected to INH1 pin and the master
termination of BUS2 is connected to INH2 pin, instead of being connected to the power supply V
and
A separate Master Termination Switch is implemented at pins BUS1 and BUS2, to avoid a voltage drop on the
recessive level of LIN bus, in case of a dominant level or a short to ground on at the LIN bus.
4.15
The device fulfills the Physical Layer Specification of LIN 1.2, 1.3, 2.0 and 2.1.
The differences between LIN specification 1.2 and 1.3 is mainly the physical layer specification. The reason was
to improve the compatibility between the nodes.
The LIN specification 2.0 is a super set of the 1.3 version. The 2.0 version offers new features. However, it is
possible to use the LIN 1.3 slave node in a 2.0 node cluster, as long as the new features are not used. Vice versa
it is possible to use a LIN 2.0 node in the 1.3 cluster without using the new features.
In terms of the physical layer the LIN 2.1 Specification doesn’t include any changes and is fully compliant to the
LIN Specification 2.0.
LIN 2.1 is the latest version of the LIN specification, released in December 2006.
Data Sheet
Figure
T
J
<
S
, would cause a constantly drawn current even in sleep mode. The resulting resistance of this short to
T
jSD
18). Internally, the 30 kΩ path is also switched off from the power supply V
Over Temperature protection
3.3 V and 5 V Logic Capability
BUS Short to GND Feature
LIN Specifications 1.2, 1.3, 2.0 and 2.1
, the output stages are re-enabled and data communication can start again on BUS1 and BUS2. A
V
IO
pin. No external pull-up resistors are required.
Figure
V
IO
1). An over temperature event will not cause any mode change nor will it be
pin. The RxD1 output and RxD2 output are push-pull outputs, they work on the
18
V
IO
. The TLE7269G can be set from Sleep
V
IO
V
.
IO
. The inputs (TxD1, TxD2) take
S
Functional Description
(see
Rev. 1.2, 2007-11-13
Figure
S
(see
TLE7269G
1).
Figure 17