MCP23S08-E/SS Microchip Technology, MCP23S08-E/SS Datasheet - Page 36

• Manufacturer Part Number: MCP23S08-E/SS
• Description: IC I/O EXPANDER SPI 8B 20SSOP
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/SS

• Package / Case: 20-SSOP
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: MCP23S08
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: Serial, SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: SSOP
• No. Of Pins: 20
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Delay Time: 50ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP23008/MCP23S08
DS21919E-page 36
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
A1
2
1
EXPOSED
A
E
Units
PAD
NOTE 1
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
1
2
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.50 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.70
2.70
0.25
0.40
20
–
Microchip Technology Drawing C04-126B
D2
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
2.80
2.80
0.30
0.50
–
L
b
K
e