SI3019-F-FM Silicon Laboratories Inc, SI3019-F-FM Datasheet - Page 125

• Manufacturer Part Number: SI3019-F-FM
• Description: IC VOICE DAA GCI/PCM/SPI 20-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: -r

Specifications of SI3019-F-FM

• Function: Data Access Arrangement (DAA)
• Interface: GCI, PCM, SPI
• Number Of Circuits: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 8.5mA
• Power (watts): *
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Includes: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 37. 20-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Dimensions (Continued)
Dimension
ZE
ZD
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in milllimeters (mm) unless
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994
3. This Land Pattern Design is based on IPC-SM-782
4. All dimensions shown are at Maximum Material Condition
1. All pads are to be non-solder mask defined (NSMD).
1. A stainless steel, laser-cut and electro-polished stencil with
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1
4. A 1.45 x 1.45 mm square aperture should be used for the
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC
otherwise noted.
specification.
guidelines.
(MMC). Least Material Condition (LMC) is calculated based
on a Fabrication Allowance of 0.05 mm.
Clearance between the solder mask and the metal pad is to
be 60  m minimum, all the way around the pad.
trapezoidal walls should be used to assure good solder
paste release.
for the perimeter pads.
center pad. This provides approximately 70% solder paste
coverage on the pad, which is optimum to assure correct
component stand-off.
J-STD-020C specification for Small Body Components.
Rev. 1.4
MIN
—
—
Si3050 + Si3011/18/19
MAX
3.31
3.31
125