HIP9011ABZ Intersil, HIP9011ABZ Datasheet - Page 3

• Manufacturer Part Number: HIP9011ABZ
• Description: IC SENSOR ENGINE KNOCK 20-SOIC
• Manufacturer: Intersil
• Type: Engine Knock Signal Processorr

Specifications of HIP9011ABZ

• Input Type: Logic
• Output Type: Logic
• Interface: SPI
• Current - Supply: 8mA
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Absolute Maximum Ratings
DC Logic Supply, V
Output Voltage, V
Input Voltage, V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
DC ELECTRICAL SPECIFICATIONS
Quiescent Supply Current
Midpoint Voltage, Pin 3
Midpoint Voltage, Pin 3
Low Input Voltage, Pins INT/HOLD, CS, SI, SCK
High Input Voltage, Pins INT/HOLD, CS, SI, SCK
Hysteresis voltage, Pins INT/HOLD, CS, SI, SCK
Internal Pull-Up Current
Internal Pull-Down Current
Low Level Output, Pin SO
High Level Output, Pin SO
Three-State Leakage Pin SO
Low Level Output, Pin 10, OSCOUT
High Level Output, Pin 10, OSCOUT
SPI BUS INTERFACE AC Parametrics
CS Falling to SCLK Rising
CS Rising to SCLK Falling
SCLK Low
SCLK High
SCLK Falling to CS Rising
Data High Setup Time
Data Low Setup Time
Data High Hold Time
Data Low Hold Time
Min Time Between 2 Programmed Words
CS Rising to INT/Hold Rising
1. θ
JA
is measured with the component mounted on an evaluation PC board in free air.
IN
O
PARAMETER
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Max
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
. . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
3
V
Unless Otherwise Specified
DD
= 5V ±5%, GND = 0V, Clock Frequency 4MHz ±0.1%, T
I Source CS, SI,
SCK, TEST
INT/HOLD
SYMBOL
o
V
C to 125
t
I Sink,
t
V
V
t
t
SCCH
t
t
t
V
V
t
V
V
PWH
t
HYST
CCH
PWL
SUH
CSH
I
V
CCL
SUL
t
V
t
CIH
DD
HH
MID
MID
HL
I
OH
OH
OL
OL
IH
L
IL
o
C
HIP9011
V
V
V
V
V
I
I
Measured at GND; V
I
I
SOURCE
SINK
SOURCE
SINK
DD
DD
DD
DD
DD
= 5.25V, GND = 0V
= 5.0V, I
= 5.0V, I
= 5.0V, Measured at GND
= 5.0V, Measured at V
TEST CONDITIONS
= 200µA, V
= -500µA; V
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Power Dissipation, P
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
Maximum Storage Temperature Range, T
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
= 1.6mA, V
= 500µA; V
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
For T
For T
At a Distance 1/16 ±1/32 inch, (1.59 ±0.79mm) from Case for
10s Max. (SOIC - Lead Tips Only)
L
L
= 2mA Source
= 0mA
A
A
DD
= -40
= 70
DD
= 5.0V
DD
DD
DD
= 5.0V
o
o
C to 125
C to 70
= 5.0V
= 5.0V
= 5.0V
A
DD
= -40
o
o
C . . . . . . . . . . . . . . . . . . . . . . . 400mW Max
C, Derate Linearly at . . . . . . . . . . 6mW/
o
C to 125
0.85
0.01
MIN
200
2.3
2.4
4.8
4.4
70
10
80
60
60
60
20
20
10
10
8
-
-
-
-
-
-
D
o
C,
TYP
2.45
5.0
2.5
-50
4.9
50
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
STG
. . . . -65
MAX
2.55
0.30
±10
8.0
2.6
5.0
1.5
30
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
January 6, 2006
o
θ
% of V
% of V
C to 150
JA
UNITS
mA
µA
µA
µA
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
120
FN4367.2
V
V
V
V
V
V
V
(
o
C/W)
DD
DD
o
o
o
o
C
C
C
C