JW050A61 TE Connectivity, JW050A61 Datasheet - Page 16

• Manufacturer Part Number: JW050A61
• Manufacturer: TE Connectivity
• Type: Step Downr

Specifications of JW050A61

• Output Power: 50W
• Number Of Outputs: 1
• Output Current: 10A
• Input Voltage: 48V
• Output Voltage: 5V
• Screening Level: Industrial
• Product Length (mm): 61mm
• Product Height (mm): 12.7mm
• Product Depth (mm): 57.9mm
• Mounting Style: Through Hole
• Pin Count: 9
• Lead Free Status / Rohs Status: Not Compliant

JW050A, JW075A, JW100A, JW150A Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 5 Vdc Output; 50 W to 150 W
Thermal Considerations
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink ( cs) and
sink-to-ambient ( sa) shown below (Figure 33).
Figure 33. Resistance from Case-to-Sink and
For a managed interface using thermal grease or foils,
a value of cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
16
16
sa
P
=
D
Sink-to-Ambient
------------------------ -
T
C
P
T
–
D
C
T
A
–
cs
cs
T
S
(continued)
sa
T
A
8-1304 (C)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
Tyco Electronics Corp
Data Sheet
July 1999