LH28F400BVHE-TL85 Sharp Electronics, LH28F400BVHE-TL85 Datasheet - Page 8

LH28F400BVHE-TL85

Manufacturer Part Number
LH28F400BVHE-TL85
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F400BVHE-TL85

Cell Type
NOR
Density
4Mb
Interface Type
Parallel
Boot Type
Top
Address Bus
19/18Bit
Operating Supply Voltage (typ)
3.3/5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7/3.3/5/12V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7/4.5V
Operating Supply Voltage (max)
3.6/5.5V
Word Size
8/16Bit
Number Of Words
512K/256K
Supply Current
65mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
DQ
RY/BY#
Symbol
BYTE#
A
GND
WE#
WP#
CE#
OE#
V
RP#
0
0
V
A
NC
-A
-DQ
CC
PP
-1
17
15
OUTPUT
OUTPUT
SUPPLY
SUPPLY
SUPPLY GROUND: Do not float any ground pins.
INPUT/
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
Type
ADDRESS INPUTS: Addresses are internally latched during a write cycle.
A
A
A
A
DATA INPUT/OUTPUTS:
DQ
status register and identifier code read cycles. Data pins float to high-impedance when the chip is
deselected or outputs are disabled. Data is internally latched during a write cycle.
DQ
read cycles in ×16 mode; not used for status register and identifier code read mode. Data pins float
to high-impedance when the chip is deselected, outputs are disabled, or in ×8 mode(Byte#=V
Data is internally latched during a write cycle.
CHIP ENABLE: Activates the device’s control logic, input buffers, decoders and sense amplifiers.
CE#-high deselects the device and reduces power consumption to standby levels.
RESET/DEEP POWER-DOWN: Puts the device in deep power-down mode and resets internal
automation. RP#-high enables normal operation. When driven low, RP# inhibits write operations
which provides data protection during power transitions. Exit from deep power-down sets the
device to read array mode. With RP#=V
blocks without WP# state. Block erase or word/byte write with V
results and should not be attempted.
OUTPUT ENABLE: Gates the device’s outputs during a read cycle.
WRITE ENABLE: Controls writes to the CUI and array blocks. Addresses and data are latched on
the rising edge of the WE# pulse.
WRITE PROTECT: Master control for boot blocks locking. When V
be erased and programmed.
BYTE ENABLE: BYTE# V
and DQ
READY/BUSY#: Indicates the status of the internal WSM. When low, the WSM is performing an
internal operation (block erase or word/byte write). RY/BY#-high indicates that the WSM is ready
for new commands, block erase is suspended, and word/byte write is inactive, word/byte write is
suspended, or the device is in deep power-down mode. RY/BY# is always active and does not float
when the chip is deselected or data outputs are disabled.
BLOCK ERASE AND WORD/BYTE WRITE POWER SUPPLY: For erasing array blocks or
writing words/bytes. With V
word/byte write with an invalid V
not be attempted.
DEVICE POWER SUPPLY: Internal detection configures the device for 2.7V, 3.3V or 5V
operation. To switch from one voltage to another, ramp V
the new voltage. Do not float any power pins. With V
memory are inhibited. Device operations at invalid V
spurious results and should not be attempted.
NO CONNECT: Lead is not internal connected; it may be driven or floated.
-1
0
11
15
-A
0
8
-A
-A
-DQ
-DQ
10
14
17
8-15
7
15
: Byte Select Address. Not used in ×16 mode.
: Row Address. Selects 1 of 2048 word lines.
: Column Address. Selects 1 of 16 bit lines.
: Main Block Address. (Boot and Parameter block Addresses are A
:Inputs data and commands during CUI write cycles; outputs data during memory array,
:Inputs data during CUI write cycles in ×16 mode; outputs data during memory array
float. BYTE# V
Table 2. Pin Descriptions
IL
PP
IH
places device in ×8 mode. All data is then input or output on DQ
places the device in ×16 mode , and turns off the A
V
PP
PPLK
(see DC Characteristics) produce spurious results and should
, memory contents cannot be altered. Block erase and
Name and Function
HH
, block erase or word/byte write can operate to all
CC
CC
voltage (see DC Characteristics) produce
V
CC
LKO
down to GND and then ramp V
, all write attempts to the flash
IH
<RP#<V
IL
, locked boot blocks cannot
HH
12
-A
produce spurious
17
-1
.)
input buffer.
Rev. 1.02
CC
IL
).
0-7
to
,

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