MB3776APF-G-BND Fujitsu Components, MB3776APF-G-BND Datasheet - Page 4

• Manufacturer Part Number: MB3776APF-G-BND
• Manufacturer: Fujitsu Components

Specifications of MB3776APF-G-BND

• Lead Free Status / Rohs Status: Not Compliant

4
MB3776A
*: The packages are mounted on the epoxy board (10 cm
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
Power supply voltage
Error amp. input voltage
Output source current
Output sink current
Power dissipation
Operating temperature
Storage temperature
Power supply voltage
Error amp. input voltage
Output source current
Output sink current
Phase compensation capacitor
Timing capacitor
Timing resistor
Oscillator frequency
Operating temperature
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Parameter
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Parameter
Symbol
I
SOURCE
Tstg
Top
I
V
SINK
P
V
CC
D
I
Symbol
Ta +25 C (SOP)
I
SOURCE
I
V
f
T
SINK
C
C
R
OSC
V
OP
CC
P
T
T
I
Ta
Ta
Condition
+25 C (SSOP)
+25 C (DIP)
10 cm
—
—
—
—
—
—
–0.2
Min
–40
100
–30
2.0
1.0
10
—
—
JEDEC
1.5 mm)
EIAJ
Value
1000
Typ
200
0.1
3.0
—
—
—
—
25
–0.3
Min
–30
–55
—
—
—
—
—
—
—
Rating
10000
Max
500
1.0
5.0
15
40
75
—
—
+125
Max
*570
*430
*580
+10
+75
–50
550
16
50
(Ta = +25 C)
Unit
kHz
mA
mA
k
pF
V
V
Unit
C
mW
mW
mW
mW
mA
mA
F
V
V
C
C