HMMC-2007 Avago Technologies US Inc., HMMC-2007 Datasheet - Page 3

• Manufacturer Part Number: HMMC-2007
• Manufacturer: Avago Technologies US Inc.

Specifications of HMMC-2007

• Number Of Switches: Dual
• Lead Free Status / Rohs Status: Compliant

3
Applications
The HMMC-2007 can be used in instrumentation,
communica-tions, radar, ECM, EW, and many other
systems requiring SPDT switching. It can be used for
pulse modulation, port isolation, transfer switching,
high-speed switching, replacement of mechanical
switches, and so on.
HMMC-2007 Scattering Parameters
(T
Freq.
GHz
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
Note:
1. Three-port-wafer-probed data: Port 1 = RF Input, Port 2 = Selected RF Output (i.e., ON throw), and Port 3 = Unselected RF Output (i.e., OFF throw).
A
= 25°C, Z
dB
-26.41
-27.53
-30.69
-32.37
-31.79
-30.60
-28.53
-27.14
-26.46
-27.03
-28.64
-29.55
-26.88
-23.24
-21.53
-21.21
-20.92
-19.88
-18.65
-17.04
o
= 50Ω, V
S
Mag. Ang.
0.048
0.042
0.029
0.024
0.026
0.030
0.037
0.044
0.048
0.045
0.037
0.033
0.045
0.069
0.084
0.087
0.090
0.101
0.117
0.141
11
sel
-57.11
-113.83
-176.73
115.57
61.35
4.27
-58.32
-124.01
172.69
107.19
32.44
-59.18
-156.32
130.95
70.91
15.06
-41.26
-104.30
-175.05
116.96
high = 0V, V
dB
-1.08
-1.13
-1.18
-1.21
-1.25
-1.30
-1.33
-1.34
-1.37
-1.40
-1.42
-1.45
-1.51
-1.56
-1.52
-1.62
-1.64
-1.66
-1.84
-1.90
[1]
sel
(Insertion Loss)
low = -10V)
S
Mag. Ang.
0.88
0.88
0.87
0.87
0.87
0.86
0.86
0.86
0.85
0.85
0.85
0.85
0.84
0.84
0.84
0.83
0.83
0.83
0.81
0.80
21
-49.06
-93.69
-138.08
177.39
133.00
88.53
-0.53
-45.16
-89.79
-134.56
135.54
90.76
46.04
0.47
-44.44
-90.23
-135.81
179.24
44.08
-179.46
S
(Isolation)
dB
-67.74
-60.55
-56.17
-53.18
-50.38
-47.63
-45.67
-44.12
-42.68
-41.45
-40.28
-39.16
-38.12
-37.13
-36.36
-35.64
-34.83
-34.13
-33.62
-34.14
Assembly Techniques
GaAs MMICs are ESD sensitive. ESD preventive
measures must be employed in all aspects of storage,
handling, and assembly. MMIC ESD precautions,
handling considerations, die attach and bonding meth-
ods are critical factors in successful GaAs MMIC
performance and reliability. Avago application note
#54, “GaAs MMIC ESD, Die Attach and Bonding Guide-
lines” provides basic information on these subjects.
31
dB
-28.40
-24.74
-31.91
-31.31
-28.90
-32.95
-29.26
-30.61
-32.21
-36.49
-34.51
-32.44
-27.18
-23.83
-21.48
-21.73
-22.22
-20.42
-18.17
-16.31
(ON Throw)
S
Mag. Ang.
0.02
0.02
0.06
0.08
0.03
0.05
0.02
0.03
0.03
0.02
0.02
0.01
0.01
0.02
0.04
0.08
0.07
0.09
0.12
0.15
22
-47.94
-117.54
168.76
119.22
68.41
-11.68
-44.21
-113.40
165.53
141.98
4.26
-100.27
176.54
122.00
51.31
-15.06
-81.88
-145.01
145.14
85.15
dB
-32.26
-30.79
-30.35
-26.21
-26.38
-25.66
-22.99
-22.41
-21.68
-19.88
-19.89
-19.03
-18.28
-18.67
-18.61
-17.65
-16.95
-16.07
-14.94
-14.31
(OFF Throw)
S
Mag. Ang.
0.024
0.029
0.030
0.049
0.048
0.052
0.071
0.076
0.082
0.101
0.101
0.112
0.122
0.117
0.117
0.131
0.142
0.157
0.179
0.193
33
47.18
-38.11
-64.68
-134.70
151.66
103.24
38.61
-21.25
-75.25
-133.81
167.02
115.49
56.80
-2.63
-60.32
-124.25
172.46
115.03
59.82
3.39