PKR2113APIA Ericsson Power Modules, PKR2113APIA Datasheet - Page 24

• Manufacturer Part Number: PKR2113APIA
• Description: Module DC-DC 1-OUT 12V 1A 12W 18-Pin
• Manufacturer: Ericsson Power Modules
• Type: Step Downr

Specifications of PKR2113APIA

• Output Current: 1 A
• Output Voltage: 12 V
• Input Voltage: 18 to 36 V
• Number Of Outputs: 1
• Output Power: 12 W

Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection reflow or vapor phase reflow in SnPb or Pb-free
reflow processes.
Mounting Options
The surface mount version is available in two options, SnPb
based or SnAgCu based (Pb-free) solder bumps.
The SnPb solder bumps are intended for SnPb solder paste
on the host board and to be reflowed in SnPb reflow process
temperatures, typically +210 to +220°C.
The Pb-free solder bumps are intended for Pb-free solder
paste on the host board and to be reflowed in Pb-free reflow
process temperatures, typically +235 to +250°C.
Note that recommendations for minimum and maximum pin
temperature — and maximum peak product temperature — are
different depending on mounting option, reflow process type
and if the dry packing of the products has been kept intact.
General Reflow Profile Recommendations
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and to minimize the time in
reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
1
Reflow process specifications
Average ramp-up rate
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
Minimum pin temperature
Peak product temperature
Average ramp-down rate
Maximum time 25°C to peak
Prepared (also subject responsible if other)
MICKAOV
Approved
SEC/D (Julia You)
Note: for mixed SnPb / Pb-free soldering, special recommendations apply
PKR 2000A series
DC/DC converters, Input 18-36 V, Output up to 2 A/15 W
Temperature
T
L
T
PIN
minimum
Time in preheat
T
/ soak zone
PRODUCT
Time 25°C to peak
L
1
maximum
T
T
T
L
PIN
PRODUCT
SnPb eutectic
3°C/s max
+183°C
30 s
+210°C
+225°C
6°C/s max
6 minutes
Time in
reflow
Checked
See §1
profile
Pb-free
3°C/s max
+221°C
30 s
+235°C
+260°C
6°C/s max
8 minutes
Pin
Product
profile
Time
PROD. SPECIFICATION MECHANICAL
No.
5/1301-BMR 6401 Uen
Date
2007-10-08
Mixed Solder Process Recommendations
When using products with Pb-free solder bumps and thereby
mixing Pb-free solder with SnPb paste on the host board and
reflowing at SnPb process temperatures (backwards
compatibility), special recommendations apply.
An extended preheat time between +170°C and +180°C for
60 to 90s and a pin reflow temperature (T
and +225°C for 30 to 60 s is recommended.
The extended preheat and soak at reflow temperature will
minimize temperature gradients and maximize the wetting
and solder mixing in the final solder joints. The use of nitrogen
reflow atmosphere will further improve the solder joint quality.
Dry Pack Information
Products intended for Pb-free reflow processes are delivered
in standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices). The SnPb
option of this product is also delivered in dry packing.
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Thermocoupler Attachment
Temperature
Pin 5 of pin 14 for measurement of minimum
pin (solder joint) temperature, T
170°C to 180°C
Technical Specifi cation
EN/LZT 146 352 R2C September 2007
© Ericsson Power Modules AB
Rev
D
60-90 s
PIN
Reference
221°C to 225°C
30-60 s
Top of PCB near pin
9 or pin 10 for
measurement of
maximum product
temperature, T
PIN
) between +220°C
Solder bump
Profile
PRODUCT
Time
1 (5)
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