STM32F417IGH6 STMicroelectronics, STM32F417IGH6 Datasheet - Page 145

Microcontrollers (MCU) ARM M4 1024 FLASH 168 Mhz 192kB SRAM

STM32F417IGH6

Manufacturer Part Number
STM32F417IGH6
Description
Microcontrollers (MCU) ARM M4 1024 FLASH 168 Mhz 192kB SRAM
Manufacturer
STMicroelectronics
Datasheets

Specifications of STM32F417IGH6

Core
ARM Cortex M4
Processor Series
STM32F4
Data Bus Width
32 bit
Maximum Clock Frequency
168 MHz
Program Memory Size
1024 KB
Data Ram Size
192 KB
On-chip Adc
Yes
Number Of Programmable I/os
140
Number Of Timers
10
Operating Supply Voltage
1.7 V to 3.6 V
Package / Case
UFBGA-176
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
24
Interface Type
CAN, I2C, I2S, SPI, UART
Program Memory Type
Flash
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F417IGH6
Manufacturer:
STMicroelectronics
Quantity:
480
Part Number:
STM32F417IGH6
Manufacturer:
ST
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Part Number:
STM32F417IGH6
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STM32F415xx, STM32F417xx
6.2
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 88.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA176 - 10× 10 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 022063 Rev 1
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
Package characteristics
45
40
39
max + P
I/O
max),
°C/W
Unit
145/156

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