NCP382HD05AAR2G ON Semiconductor, NCP382HD05AAR2G Datasheet - Page 4

• Manufacturer Part Number: NCP382HD05AAR2G
• Manufacturer: ON Semiconductor

Specifications of NCP382HD05AAR2G

• Lead Free Status / Rohs Status: Compliant

6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
7. The R
8. The maximum power dissipation (P
OPERATING CONDITIONS
Symbol
C
I
V
I
final PCB layout.
R
OUTX
SINK
V
C
OUTX
P
ENX
T
T
qJA
IN
IN
A
D
J
qJA
is dependent of the PCB heat dissipation. Announced thermal resistance is the unless PCB dissipation and can be improve with
Operational Power Supply
Enable Voltage
Ambient Temperature Range
FLAG sink current
Decoupling input capacitor
Decoupling output capacitor
Thermal Resistance Junction−to−Air
Junction Temperature Range
Recommended Maximum DC
current
Power Dissipation Rating (Note 8)
Parameter
D
) is given by the following formula:
T
T
A
A
v 25°C
http://onsemi.com
= 85°C
SOIC−8 package (Notes 6 and 7)
DFN−8 package (Notes 6 and 7)
USB port per Hub
SOIC−8 package
4
DFN−8 package
Conditions
P
SOIC−8 package
SOIC−8 package
D
DFN−8 package
DFN−8 package
+
T
JMAX
R
qJA
* T
A
Min
−40
120
−40
850
570
428
285
2.5
0
1
Typ
140
210
25
25
+125
Max
+85
5.5
5.5
1.5
1
1
°C/W
°C/W
Unit
mW
mW
mW
mW
mA
°C
mF
mF
°C
V
A
A