SFSD1024L1BN2TO-I-ME-151-STD Swissbit, SFSD1024L1BN2TO-I-ME-151-STD Datasheet - Page 19

• Manufacturer Part Number: SFSD1024L1BN2TO-I-ME-151-STD
• Manufacturer: Swissbit

Specifications of SFSD1024L1BN2TO-I-ME-151-STD

• Lead Free Status / Rohs Status: Supplier Unconfirmed

product group (2)
Swissbit
Memory (1)
S: SDRAM SDR
D: SDRAM DDR
E: SDRAM DDR2
G: SDRAM DDR3
Module type (3)
SDR
DDR
DDR2 U: 240 Pin UDIMM 1.8 V
DDR3 U: 240 Pin UDIMM 1.5 V
Data Depth (4)
008: 64 MB
016: 128 MB
032: 256 MB
064: 512 MB
128: 1 GB
Data Width (5)
32: w/o Parity
36: w/ Parity
64: w/o ECC
72: w/ ECC
printed circuit board with Revision (6)
DRAM pARt nUMbER DEcODER
U: 168 Pin UDIMM 3.3 V
R: 168 Pin RDIMM 3.3 V
N: 144 Pin SODIMM 3.3 V
U: 184 Pin UDIMM 2.5 V
R: 184 Pin RDIMM 2.5 V
N: 200 Pin SODIMM 2.5 V
M: 172 Pin Micro-DIMM 2.5 V
R: 240 Pin RDIMM 1.8 V, w/o Parity
P: 240 Pin RDIMM 1.8 V, w/ Parity
F: 240 Pin FBDIMM
N: 200 Pin SODIMM 1.8 V
G: 200 Pin SO-RDIMM 1.8 V
H: 244 Pin Mini RDIMM 1.8 V, w/ Parity
M: 214 Pin MicroDIMM 1.8 V
P: 240 Pin RDIMM 1.5 V
N: 204 Pin SODIMM/SOUDIMM 1.5 V
M: 214 Pin MicroDIMM 1.5 V
256: 2 GB
512: 4 GB
01G: 1 GB
02G: 2 GB
04G: 4 GB
S
1
g
2
n
3
02g
4
64
5
E1
6
b
7
F
8
2
9
SA
10
-
bb
11
DDR3 AA: DDR3-800 CL5
DDR2 50: DDR2-400 CL3
DDR
SDR
12
*
BA: DDR3-1066 CL6
CA: DDR3-1333 CL7
CC: DDR3-1333 CL9
DA: DDR3-1600 CL9
DC: DDR3-1600 CL11
30: DDR2-667 CL5
25: DDR2-800 CL6
BB: DDR2-1066 CL7
08: DDR-200 CL2
70: DDR-266A CL2
60: DDR-333B CL2.5 6A: DDR-333A CL2
50: DDR-400B CL3
10: PC-100 CL3
75: PC-133 CL3
R
13
DRAM Manufacturer (10 )
A: x4
D: x4 TSOP Stack
B: x8
temperature Rating (12)
14
t
DRAM Organization (7)
pARt nUMbERS
Rohs/ Lead Free (13)
heat Spreader (14)
C: (or blank) (0°C to +70°C)
E: Ext. Temp.(0°C to +85°C)
I: Ext. Temp.(-25°C to +85°C)
W: Ind. Temp.(-40°C to +85°C)
DRAM Revision (8)
Module Ranks (9)
thermal Sensor /
AB: DDR3-800 CL6
BB: DDR3-1066 CL7
CB: DDR3-1333 CL8
DB: DDR3-1600 CL10
37: DDR2-533 CL4
3A: DDR2-667 CL4
2A: DDR2-800 CL5
5: DDR-266B CL2.5
7A: DDR-266A CL2
5A: DDR-400A CL2.5
08: PC-100 CL2
70: PC-133 CL2
MT: Micron Technology
EP: Elpida
QI: Qimonda
SA: Samsung
HY: Hynix
WI: Winbond
E: x8 TSOP Stack
C: x16
G: x4 BGA Stack
1: 1 Rank Module
2: 2 Rank Module
Speed (11)
19