MCP2200-I/SO Microchip Technology, MCP2200-I/SO Datasheet - Page 18

IC USB TO UART 20SOIC

MCP2200-I/SO

Manufacturer Part Number
MCP2200-I/SO
Description
IC USB TO UART 20SOIC
Manufacturer
Microchip Technology
Type
USB to UART Protocol Converterr
Datasheets

Specifications of MCP2200-I/SO

Package / Case
20-SOIC (0.300", 7.50mm Width)
Features
USB to UART
Number Of Channels
8
Fifo's
256 Byte
Protocol
USB 2.0
Voltage - Supply
3 V ~ 5.5 V
With Auto Flow Control
Yes
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Supply Current
13 mA
Operating Supply Voltage
3 V to 5.5 V
Usb Version
2.0
Data Rate
12Mbps
Supply Voltage Range
3V To 5.5V
Digital Ic Case Style
SOIC
No. Of Pins
20
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP2200-I/SO
Manufacturer:
Microchip
Quantity:
719
Part Number:
MCP2200-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP2200
TABLE 3-2:
DS22228A-page 18
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C  T
Param
Legend: TBD = To Be Determined.
Note 1:
TH01
TH02
TH03
TH04
TH05
TH06
TH07
No.
2:
3:
P
INTERNAL
I
T
T
T
DD
P
Sym
A
J
P
θ
θ
JMAX
PD
DER
I
= Junction Temperature.
JA
JC
= Ambient Temperature.
/
is the current to run the chip alone without driving any load on the output pins.
O
THERMAL CONSIDERATIONS
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to
Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
Characteristic
A
 +85C (I-Temp)
108.1
TBD
85.2
Typ
150
24
24
24
Units
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 6x6mm package
PD = P
P
P
V
P
INTERNAL
I
OH
DER
/
O
))
=  (I
= PD
INTERNAL
 2010 Microchip Technology Inc.
OL
= I
MAX
Conditions
* V
DD
(T
OL
+ P
x V
J
) +  (I
- T
I
DD
/
O
A
(1)
)/θ
OH
JA
(2,3)
* (V
DD

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