74HC32AP TOSHIBA Semiconductor CORPORATION, 74HC32AP Datasheet
74HC32AP
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74HC32AP Summary of contents
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... Pin Assignment www.DataSheet4U.com IEC Logic Symbol MOS technology μA (max 25° 28% V (min) NIL (min ∼ − t pLH pHL (opr TC74HC32AP/AF/AFN Note: xxxAFN (JEDEC SOP) is not available in Japan. TC74HC32AP TC74HC32AF TC74HC32AFN Weight DIP14-P-300-2.54 : 0.96 g (typ.) SOP14-P-300-1.27A : 0.18 g (typ.) SOL14-P-150-1.27 : 0.12 g (typ.) 2007-10-01 ...
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... Unused inputs must be tied to either VCC or GND. Symbol Rating −0.5 −0.5 −0.5~V + 0.5 V OUT CC ± ± ±25 I OUT ± 500 (DIP) (Note 2)/180 (SOP) D −65~150 T stg Symbol Rating 0~V OUT CC −40~85 T opr = 2.0 V) 0~1000 ( 4 0~500 ( 6.0 V) 0~400 ( TC74HC32AP/AF/AFN Unit °C Unit °C ns 2007-10-01 ...
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... GND GND pF 25°C, input Symbol Test Condition t TLH t THL t pLH t pHL 3 TC74HC32AP/AF/AFN Ta = 25° −40~85° Min Typ. Max Min (V) ⎯ ⎯ 2.0 1.50 1.50 ⎯ ⎯ 4.5 3.15 3.15 ⎯ ⎯ 6.0 4.20 4.20 ⎯ ⎯ ⎯ 2.0 0.50 ⎯ ...
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... I CC www.DataSheet4U.com = 50 pF, input ns Test Condition t TLH ⎯ t THL t pLH ⎯ t pHL ⎯ ⎯ (Note (per gate) ・V ・ TC74HC32AP/AF/AFN Ta = 25° −40~85° Min Typ. Max Min (V) ⎯ ⎯ 2 ⎯ ⎯ 4 ⎯ ⎯ 6 ⎯ ⎯ 2 ⎯ ⎯ 4 ⎯ ⎯ 6.0 ...
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... Package Dimensions Weight: 0.96 g (typ.) www.DataSheet4U.com TC74HC32AP/AF/AFN 5 2007-10-01 ...
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... Package Dimensions Weight: 0.18 g (typ.) www.DataSheet4U.com TC74HC32AP/AF/AFN 6 2007-10-01 ...
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... Package Dimensions (Note) Note: This package is not available in Japan. www.DataSheet4U.com Weight: 0.12 g (typ.) TC74HC32AP/AF/AFN 7 2007-10-01 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. TC74HC32AP/AF/AFN 8 20070701-EN GENERAL 2007-10-01 ...