BUK9640-100A NXP Semiconductors, BUK9640-100A Datasheet
BUK9640-100A
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BUK9640-100A Summary of contents
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... Rev. 03 — 08 February 2002 1. Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring very low on-state resistance. Product availability: BUK9540-100A in SOT78 (TO-220AB) BUK9640-100A in SOT404 (D 2. Features TrenchMOS™ technology Q101 compliant 175 C rated Logic level compatible. ...
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Philips Semiconductors 5. Quick reference data Table 2: Quick reference data Symbol Parameter V drain-source voltage (DC drain current (DC total power dissipation tot T junction temperature j R drain-source on-state resistance DSon 6. Limiting values ...
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Philips Semiconductors 120 P der (%) 100 P tot P = ---------------------- - 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of mounting base temperature ...
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Philips Semiconductors 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base R thermal resistance from junction to ambient vertical in still air; SOT78 package th(j-a) 7.1 Transient thermal impedance 1 Z ...
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Philips Semiconductors 8. Characteristics Table 5: Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage I GS(th) I drain-source leakage current DSS I gate-source leakage current GSS ...
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Philips Semiconductors Table 5: Characteristics …continued unless otherwise specified. j Symbol Parameter Source-drain diode V source-drain (diode forward) SD voltage t reverse recovery time rr Q recovered charge r 120 (V) I ...
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Philips Semiconductors 2.5 V GS(th) max (V) 2 typ 1.5 min 1 0 Fig 9. Gate-source threshold voltage as a function of junction temperature ...
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Philips Semiconductors ( 175 º Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values ...
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Philips Semiconductors 9. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB ( DIMENSIONS (mm are the original dimensions UNIT A 1 4.5 1.39 0.9 1.3 mm ...
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Philips Semiconductors Plastic single-ended surface mounted package (Philips version of D (one lead cropped DIMENSIONS (mm are the original dimensions UNIT c 4.50 1.40 0.85 0.64 mm 4.10 1.27 0.60 0.46 ...
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Philips Semiconductors 10. Soldering handbook, full pagewidth 8.35 8.15 4.85 7.95 Dimensions in mm. Fig 18. Reflow soldering footprint for SOT404. 9397 750 09162 Product data 10.85 10.60 10.50 1.50 7.50 7.40 2.15 2.25 1.50 4.60 0.30 3.00 solder lands ...
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Philips Semiconductors 11. Revision history Table 6: Revision history Rev Date CPCN Description 03 20020208 - Product data (9397 750 09162); third version; supersedes BUK95/9640-100A- May 2000. Modifications: • Conversion from Lotus Manuscript to Databuilder II • Thermal ...
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Philips Semiconductors Philips Semiconductors 12. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] ...
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Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...