BGY284 NXP Semiconductors, BGY284 Datasheet

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BGY284

Manufacturer Part Number
BGY284
Description
Manufacturer
NXP Semiconductors
Datasheet

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Part Number:
BGY284
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
DISCRETE SEMICONDUCTORS
DATA SHEET
BGY284
power amplifier with integrated
control loop for GSM850,
EGSM900, DCS1800 & PCS1900
Preliminary specification
2003 Aug 20

Related parts for BGY284

BGY284 Summary of contents

Page 1

... DISCRETE SEMICONDUCTORS DATA SHEET BGY284 power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 & PCS1900 Preliminary specification 2003 Aug 20 ...

Page 2

... MHz, 880 to 915 MHz, 1710 to 1785 MHz and 1850 to 1910 MHz. DESCRIPTION The BGY284 is a power amplifier module in a SOT775 surface mounted package with a plastic cap. The module consists of two separated line-ups, one for low band (LB,GSM850/EGSM900) and one for high band (HB, DCS1800/PCS1900) with internal power detection function, power control loop, input and output matching ...

Page 3

... RF power control input stabilized supply voltage LB (GSM850/EGSM900) HB (DCS1800/PCS1900) band select input not connected GSM850/EGSM900 transmit RF input GSM850/EGSM900 transmit RF output DCS1800/PCS1900 transmit RF output ground BAT BAT in, BAT BAT in,LB Fig.1 Simplified outline 3 Preliminary specification BGY284 DESCRIPTION 1 GND 16 RF out,HB 15 GND 14 RF out,LB 13 GND ...

Page 4

... GSM850, EGSM900, DCS1800 & PCS1900 INTERNAL CIRCUIT RF in,LB V DAC Power controller V STAB v TXon Logic * control * v band RF in,HB 2003 Aug 20 850/900 MHz PA output match power sense biasing + - biasing power sense output match 1800/1900 MHz PA Fig.2 Internal circuit 4 Preliminary specification BGY284 RF out,LB RF out,HB BGY284 = pull down resistor * ...

Page 5

... For every line-up the power amplifier block generates a detected output power signal, that is an input to the power control block. Control logic In the control logic block the various signals are generated to control the complete BGY284 out of V indicated in the mode control table. The V in idle mode and the battery current consumption is almost zero. ...

Page 6

... TXon before V ramp in HB,LB DAC after transition V to logic 1 DAC TXon to logic 0 after V signal to off TXon DAC to logic 0 TXon after V to logic 0 band TXon after V in HB,LB DAC 6 Preliminary specification BGY284 t 10 µs 8 µs 10 µs 3 MIN. TYP. MAX TXon signal to off ...

Page 7

... DAC approximately a quarter cosine wave ramp- and that in the same time there is no violation of the spectrum due to transients. To avoid violation of the lowest power level in the GSM power mask (indicated by *), the BGY284 has to give sufficient isolation in following condition: V TXon For GSM850/EGSM900 the system specification for maximum output power level of the handset in this condition is 36 dBm ...

Page 8

... HB TX mode BAT T storage temperature stg T operating mounting base mb temperature 2003 Aug 20 CONDITIONS idle mode mode in HB,LB out LB out mode LB TX mode LB TX mode = Preliminary specification BGY284 MIN. MAX. UNIT 7 V 5.3 V 0.5 3 dBm 37 dBm 35 dBm ...

Page 9

... Note 2 standby mode idle mode standby mode idle mode mode standby mode V 4.6 V; 2.6 V BAT STAB DAC conditions, but will not meet all electrical specification points. 9 Preliminary specification BGY284 MIN. TYP. MAX. 2.9 3.1 3.1 3.6 4.6 4.6 5 2.6 2.8 3 ...

Page 10

... DAC L LB see note 1 and dBm L LB measured out measured out dBm 0. DAC standby mode P 2 dBm 0. DAC LB TX mode P < 5 dBm dBm Preliminary specification BGY284 t 2300 dBm MIN. TYP. MAX 0.2 35 dBm dBm 1.5 1 dBm 1.5 1.5 31 dBm ...

Page 11

... MHz for GSM850 3 BAT P +2 dBm 824 to 849 MHz for GSM850 3 BAT 0 dBm 824 to 849 MHz for GSM850 3 BAT STAB 11 Preliminary specification BGY284 MIN. TYP. MAX 250 2 200 36 no degradation = 2.8 V ± STAB 4 2.8 V ± STAB = 2.8 V ± ...

Page 12

... L HB see note 1 and 3 V set to have 30 P DAC L HB see note 1 and dBm dBm 0. DAC standby mode P 2 dBm 0. DAC HB TX mode P < 2 dBm dBm Preliminary specification BGY284 t 2300 dBm MIN. TYP. MAX 0.2 32.7 33.5 31 dBm dBm; 1.5 1 dBm; ...

Page 13

... MHz for DCS1800 3 BAT P +2 dBm 1710 to 1785 MHz for DCS1800 3 BAT 0 dBm 1710 to 1785 MHz for DCS1800 3 BAT STAB 13 Preliminary specification BGY284 MIN. TYP. MAX 250 2 200 36 no degradation 4 2.8 V ± STAB 4 2.8 V ± STAB = 2.8 V ± ...

Page 14

... PA itself, when the noise at the input of the 2003 Aug LCON SS1 SS2 SS2 SSG = LSS2 SS2 Fig.5 Input and output signals for small signal gain amplified by the conversion gain SS1 amplified by the small signal gain SS2 14 Preliminary specification BGY284 SS1 P L CON SS1 0 0 SS1 SS2 SS2 ...

Page 15

... N. in,LB Note: pin 9 must not have any driving signals attached to it 2003 Aug 20 V BAT BAT in,HB V DAC PAM 1 V STAB v band BAT in, BAT Fig.6 Test circuit. 15 Preliminary specification BGY284 GND BAT out,HB GND out,LB GND BAT out,HB RF out,LB ...

Page 16

... SMD capacitor 0603 size SMD capacitor 0603 size SMD capacitor Electrol. capacitor 0603 size SMD resistor 0603 size SMD resistor stripline; note 1 = 4.6); thickness 0 BAT 16 Preliminary specification BGY284 REMARK SUPPLIER Roland Haefele Type no. Johnson 142-0701-881 Components note 2 Matsushita width 1.4 mm ...

Page 17

... GSM850, EGSM900, DCS1800 & PCS1900 Q87Ã9r†vtÃQ7$C 8‚ 8‚$ S" 8‚! 2003 Aug 8" 8& Fig.7 PCB testcircuit. 17 Preliminary specification BGY284 8‚" 8‚# 8‚% ...

Page 18

... SOLDERING RECOMMENDATIONS Reflow profile: The BGY284 is a laminate based PA module in a LGA package. The module can be assembled using a standard SMT reflow process in a convection or IR-oven. In the graph below (see Fig.8) the minimum and maximum limits of the temperature profile are given. The actual profile has to be within these limits, and will depend on the PCB material, the number and size of the components to be assembled, and the type of solder which is being used ...

Page 19

... If a thinner or thicker stencil is being used, the dimensions of the stencil apertures have to be adjusted. Moisture sensitivity level: The BGY284 is tested according to the JEDEC standard JESD 22-A113C. The BGY284 is classified on MSL3 for a lead containing soldering profile with a peak temperature of 240 C, and on MSL4 for a lead free soldering profile with a peak temperature of 260 C. ...

Page 20

... Philips Semiconductors power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 & PCS1900 2003 Aug 20 Fig.9 Footprint layout and solder stencil design. 20 Preliminary specification BGY284 ...

Page 21

... Philips Semiconductors power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 & PCS1900 PACKAGE OUTLINE 2003 Aug Preliminary specification BGY284 ...

Page 22

... Preliminary specification BGY284 DEFINITION These products are not Philips Semiconductors ...

Page 23

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited ...

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