MMDF2P02ER2 Motorola, MMDF2P02ER2 Datasheet
MMDF2P02ER2
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MMDF2P02ER2 Summary of contents
Page 1
... Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10 sec. max. ORDERING INFORMATION Device Reel Size MMDF2P02ER2 embossed tape Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — ...
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... S = 2.0 Adc Vdc 2.0 Adc Vdc 2.0 Adc Vdc /dt = 100 /dt = 100 /dt = 100 2%. Motorola TMOS Power MOSFET Transistor Device Data Min Typ Max Unit Vdc 25 — — — 2.2 — ...
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... 1.5 1.0 0.5 0 – 50 – JUNCTION TEMPERATURE ( C) Figure 5. On–Resistance Variation with Temperature Motorola TMOS Power MOSFET Transistor Device Data 1 GATE–TO–SOURCE VOLTAGE (VOLTS) Figure 2. Transfer Characteristics 0 ...
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... Figure 8. Gate–to–Source and Drain–to–Source Voltage versus Total Charge VGS = 0 V 1.6 1.2 0.8 0.4 0 100 0.6 0 SOURCE–TO–DRAIN VOLTAGE (VOLTS) Figure 10. Diode Forward Voltage Motorola TMOS Power MOSFET Transistor Device Data ...
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... R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 12. Maximum Rated Forward Biased Safe Operating Area Motorola TMOS Power MOSFET Transistor Device Data di/dt = 300 A/ s Standard Cell Density t rr High Cell Density TIME Figure 11. Reverse Recovery Time ( ...
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... Figure 15. Diode Reverse Recovery Waveform 6 Normalized 10s. Chip 0.0175 0.0710 0.0154 F 0.0854 F 1.0E–02 1.0E–01 1.0E+00 t, TIME (s) Figure 14. Thermal Response di/ 0. Motorola TMOS Power MOSFET Transistor Device Data 0.2706 0.5776 0.7086 0.3074 F 1.7891 F 107.55 F Ambient 1.0E+01 1.0E+02 1.0E+03 TIME ...
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... When using infrared heating with the reflow soldering method, the difference shall be a maximum Motorola TMOS Power MOSFET Transistor Device Data between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 16. Typical Solder Heating Profile Motorola TMOS Power MOSFET Transistor Device Data STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX ...
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... G –T– SEATING PLANE D 8X 0.25 (0.010 Motorola TMOS Power MOSFET Transistor Device Data PACKAGE DIMENSIONS CASE 751–05 SO–8 ISSUE P MMDF2P02E NOTES: 1. DIMENSIONS A AND B ARE DATUMS AND DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14 ...
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... Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “ ...