PDIUSBD12PW Philips Semiconductors, PDIUSBD12PW Datasheet
PDIUSBD12PW
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PDIUSBD12PW Summary of contents
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PDIUSBD12 USB interface device with parallel bus Rev. 07 — 27 November 2001 1. Description The PDIUSBD12 is a cost and feature optimized USB device normally used in microcontroller based systems and communicates with the system microcontroller over ...
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... Philips Semiconductors Data transfer rates: 1 Mbytes/s achievable in Bulk mode, 1 Mbits/s achievable in Isochronous mode Bus-powered capability with very good EMI performance Controllable LazyClock output during suspend Software controllable connection to the USB bus (SoftConnect™) Good USB connection indicator that blinks with traffic (GoodLink™) ...
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... Philips Semiconductors 3.2 Pin description Table 1: Symbol DATA <0> DATA <1> DATA <2> DATA <3> GND DATA <4> DATA <5> DATA <6> DATA <7> ALE CS_N SUSPEND 12 CLKOUT INT_N RD_N WR_N DMREQ DMACK_N 18 EOT_N RESET_N GL_N XTAL1 XTAL2 9397 750 08969 Product data Pin description [1] Pin Type Description ...
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... HIGH. Outside North America PDIUSBD12 D PDIUSBD12 PW Rev. 07 — 27 November 2001 PDIUSBD12 USB interface device with parallel bus pins. OUT3.3 North America Pkg. Dwg. # PDIUSBD12 D SOT136-1 PDIUSBD12PW DH SOT361-1 © Koninklijke Philips Electronics N.V. 2001. All rights reserved ...
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... Philips Semiconductors 6. Functional description 6.1 Analog transceiver The integrated transceiver interfaces directly to the USB cables through termination resistors. 6.2 Voltage regulator A 3.3 V regulator is integrated on-chip to supply the analog transceiver. This voltage is also provided as an output to connect to the external 1.5 k pull-up resistor. Alternatively, the PDIUSBD12 provides SoftConnect technology with an integrated 1 ...
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... Philips Semiconductors It should be noted that the tolerance of the internal resistors is higher (25%) than that specified by the USB specification (5%). However, the overall V specification for the connection can still be met with good margin. The decision to make sure of this feature lies with the users. ...
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... Philips Semiconductors Fig 3. Example of a parallel interface to an 80C51 microcontroller. 7. DMA transfer Direct Memory Address (DMA) allows an efficient transfer of a block of data between the host and local shared memory. Using a DMA controller, data transfer between the PDIUSBD12’s main endpoint (endpoint 2) and local shared memory can happen autonomously without local CPU intervention ...
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... Philips Semiconductors operation before the data is sent to the host. The only exception is at the end of DMA transfer, when the reception of pin EOT_N will stop DMA write operation and the buffer content will be sent to the host on the next IN token. For isochronous transfers, the local CPU and DMA controller have to guarantee that they are able to sink or source the maximum packet size in one USB frame (1 ms) ...
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... Philips Semiconductors Table 3: Endpoint number Mode 0 (Non-ISO mode Mode 1 (ISO-OUT mode Mode 2 (ISO-IN mode Mode 3 (ISO-I/O mode [1] IN: input for the USB host; OUT: output from the USB host. [2] Generic endpoints can be used either as Bulk or Interrupt endpoint. ...
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... Philips Semiconductors 9. Main endpoint The main endpoint (endpoint number 2) is the primary endpoint for sinking or sourcing relatively large amounts of data. It implements the following features to ease this task: • Double buffering. This allows parallel operation between USB access and local CPU access thus increasing throughput. Buffer switching is handled automatically. ...
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... Philips Semiconductors Table 4: Name Set Endpoint Status Acknowledge Setup Clear Buffer Validate Buffer General commands Send Resume Read Current Frame Number 11. Command description 11.1 Command procedure There are three basic types of commands: Initialization, Data Flow and General commands. Respectively, these are used to initialize the function; for data flow between the function and the host ...
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... Philips Semiconductors 11.2.2 Set endpoint enable Code (Hex) — D8 Transaction — write 1 byte The generic/Isochronous endpoints can only be enabled when the function is enabled via the Set Address/Enable command. GENERIC/ISOCHRONOUS ENDPOINT: A value of ‘1’ indicates the generic/isochronous endpoints are enabled. Fig 5. Set endpoint enable command: bit allocation. ...
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... Philips Semiconductors Table 5: Bit See Fig 7. Set mode command, Clock division factor byte. 9397 750 08969 Product data Set mode command, Configuration byte: bit allocation Symbol Description ENDPOINT These two bits set the endpoint configurations as follows: ...
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... Philips Semiconductors Table 6: Bit CLOCK DIVISION 11.2.4 Set DMA Code (Hex) — FB Transaction — read/write 1 byte The set DMA command is followed by one data write/read to/from the DMA configuration register. DMA Configuration register: (status and byte length information) is not transferred to/from the local CPU. This allows DMA data to be continuous and not interleaved by chunks of these headers ...
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... Philips Semiconductors Table 7: Bit 11.3 Data flow commands Data flow commands are used to manage the data transmission between the USB endpoints and the external microcontroller. Much of the data flow is initiated via an interrupt to the microcontroller. The microcontroller utilizes these commands to access and determine whether the endpoint FIFOs have valid data ...
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... Philips Semiconductors This command indicates the origin of an interrupt. The endpoint interrupt bits (bits are cleared by reading the endpoint last transaction status register through Read Last Transaction Status command. The other bits are cleared after reading the interrupt registers. See Fig 9. Interrupt Register, byte 1. DMA EOT: This bit signifi ...
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... Philips Semiconductors 11.3.2 Select Endpoint Code (Hex) — Transaction — read 1 byte (optional) The Select Endpoint command initializes an internal pointer to the start of the selected buffer. Optionally, this command can be followed by a data read, which returns this byte. FULL/EMPTY: A ‘1’ indicates the buffer is full, ‘0’ indicates an empty buffer. ...
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... Philips Semiconductors This command is useful for debugging purposes. Since it keeps track of every transaction, the status information is overwritten for each new transaction. See Fig 13. Read last transaction status register. Table 9: Bit Table 10: Error code (Binary) 0000 0001 0010 0011 ...
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... Philips Semiconductors Table 10: Error code (Binary) 1011 1101 1111 11.3.5 Read buffer Code (Hex) — F0 Transaction — read multiple bytes (max. 130) The Read Buffer command is followed by a number of data reads, which returns the contents of the selected endpoint data buffer. After each read, the internal buffer pointer is incremented by 1 ...
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... Philips Semiconductors successful transaction. The exception is during DMA operation on the main endpoint (endpoint 2), in which case the pointer is automatically pointed to the second buffer after reaching the boundary (double buffering scheme). 11.3.7 Clear buffer Code (Hex) — F2 Transaction — none When a packet is received completely, an internal endpoint buffer full flag is set. All subsequent packets will be refused by returning a NAK ...
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... Philips Semiconductors The arrival of a SETUP packet flushes the IN buffer and disables the Validate Buffer and Clear Buffer commands for both IN and OUT endpoints. The microcontroller needs to re-enable these commands by the Acknowledge Setup command. This ensures that the last SETUP packet stays in the buffer and no packet can be sent back to the host until the microcontroller has acknowledged explicitly that it has seen the SETUP packet ...
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... Philips Semiconductors 12. Interrupt modes Table 11: SOF-ONLY INTERRUPT MODE [1] Bit 7 of Clock division factor byte of Set mode command (see [2] Bit 5 of Set DMA command (see [3] Normal interrupts from Interrupt Register. 13. Limiting values Table 12: In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... Philips Semiconductors 14. Static characteristics Table 14: DC characteristics (digital pins) Symbol Parameter Input levels V LOW level input voltage IL V HIGH level input voltage IH V hysteresis voltage HYS Output levels V LOW level output voltage OL V HIGH level output voltage OH Leakage current I OFF-state current ...
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... Philips Semiconductors 15. Dynamic characteristics Table 16: AC characteristics (AI/O pins; FULL speed pF 1 Symbol Parameter Driver characteristics t rise time R t fall time F t rise/fall time matching (t /t RFM R V output signal crossover voltage CRS Driver timings t source EOP width ...
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... Philips Semiconductors Table 17: AC characteristics (parallel interface) Symbol Parameter ALE timings t ALE HIGH pulse width LH t address valid to ALE LOW time AVLL t ALE LOW to Address transition time LLAX Write timings t CS_N (DMACK_N) LOW to WR_N LOW time CLWL t WR_N HIGH to CS_N (DMACK_N) HIGH time ...
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... Philips Semiconductors t CLRL t CLWL CS_N DMACK_N t AVRL t AVWL A0 WR_N DATA[7:0] RD_N DATA[7:0] Fig 18. Parallel interface timing (I/O and DMA). Table 18: AC characteristics (DMA) Symbol Parameter Single-cycle DMA timings t DMACK_N HIGH to DMREQ HIGH time AHRH t RD_N/WR_N HIGH to DMACK_N HIGH time SHAH t DMREQ HIGH to RD_N/WR HIGH time ...
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... Philips Semiconductors DMREQ DMACK_N RD_N/WR_N (1) EOT_N EOT_N is considered valid when DMACK_N, RD_N/WR_N and EOT_N are all LOW. Fig 19. Single-cycle DMA timing. DMREQ DMACK_N RD_N/WR_N Fig 20. Burst DMA timing. Fig 21. DMA terminated by EOT. 9397 750 08969 Product data t RHSH t AHRH t SHAH t EL ...
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... Philips Semiconductors 16. Test information The dynamic characteristics of the analog I/O ports (D and listed in were determined using the circuit shown in Fig 22. Load for 9397 750 08969 Product data USB interface device with parallel bus Figure 1.5k IS INTERNAL TEST POINT 15k Rev. 07 — ...
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... Philips Semiconductors 17. Package outline SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.30 2.45 mm 2.65 0.25 0.10 2.25 0.012 0.096 0.019 inches 0.10 0.01 0.004 0.089 0.014 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... Philips Semiconductors TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.10 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Philips Semiconductors 18. Soldering 18.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fi ...
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... Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications ...
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... Philips Semiconductors 19. Revision history Table 20: Revision history Rev Date CPCN Description 07 20011127 Product specification (7379 750 08969). Modifications: • Changed in • In Section 7 “DMA transfer” • In Section 11.3.5 “Read buffer” • In Section 13 “Limiting values” Table 12 “Limiting values” ...
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... Philips Semiconductors Table 20: Revision history …continued Rev Date CPCN Description 07 20011127 Modifications (continued): • Made the following changes in – Parameter ‘DMACK_N HIGH to DMREQ HIGH time’ changed the Max value from 550 to 330. – Removed the timings t – Added the timing t – ...
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... This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. ...
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... Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 6.1 Analog transceiver . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Voltage regulator 6.3 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.4 Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 5 6.5 Philips Serial Interface Engine (PSIE 6.6 SoftConnect . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.7 GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.8 Memory Management Unit (MMU) and Integrated RAM ...