JW100B Lineage Power, JW100B Datasheet - Page 16

• Manufacturer Part Number: JW100B
• Manufacturer: Lineage Power

JW050B, JW075B, JW100B, JW150B Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 12 Vdc Output; 50 W to 150 W
Thermal Considerations
Custom Heat Sinks
For a managed interface using thermal grease or foils,
a value of cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
16
16
sa
=
------------------------ -
T
C
P
–
D
T
A
–
cs
(continued)
(continued)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
Data Sheet
April 2008
Lineage Power