MT58L256L32P Micron Semiconductor Products, MT58L256L32P Datasheet
MT58L256L32P
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MT58L256L32P Summary of contents
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... Operating Temperature Range Commercial (0°C to +70°C) Industrial (-40°C to +85°C)** Part Number Example: MT58L512L18PT-6 8Mb: 512K x 18, 256K x 32/36 Pipelined, SCD SyncBurst SRAM MT58L512L18P_C.p65 – Rev. 2/02 PIPELINED, SCD SYNCBURST SRAM ™ MT58L512L18P, MT58L256L32P, MT58L256L36P; MT58L512V18P, MT58L256V32P, MT58L256V36P 3.3V V Deselect ) DD ® BSRAM-compatible) MARKING -6 -7 ...
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ADDRESS SA0, SA1, SAs REGISTER MODE ADV# CLK ADSC# ADSP# BYTE “b” WRITE REGISTER BWb# BYTE “a” WRITE REGISTER BWa# BWE# GW# ENABLE CE# REGISTER CE2 CE2# OE# 18 ADDRESS SA0, SA1, SAs REGISTER MODE ADV# CLK ADSC# ADSP# ...
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GENERAL DESCRIPTION (continued) (GW#). Note that CE2# is not available on the T Version. Asynchronous inputs include the output enable (OE#), clock (CLK) and snooze enable (ZZ). There is also a burst mode input (MODE) that selects between inter- leaved ...
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TQFP PIN ASSIGNMENT TABLE PIN # x18 x32/x36 PIN # 1 NC NF/DQPc DQc DQc DQc DQc 32 8 ...
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ADV# 83 ADSP# 84 ADSC# 85 OE# 86 BWE# 87 GW# 88 CLK BWa# 93 BWb CE2 97 CE ...
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ADV# 83 ADSP# 84 ADSC# 85 OE# 86 BWE# 87 GW# 88 CLK CE2# 92 BWa# 93 BWb CE2 97 CE ...
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TQFP PIN DESCRIPTIONS x18 x32/x36 SYMBOL 32-35, 44-50, 32-35, 44-50, 80-82, 99, 81, 82, 99, 100 100 92 (T Version Version Version Version BWa BWb# – ...
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TQFP PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 84 84 ADSP ADSC MODE (a) 58, 59, (a) 52, 53, 62, 63, 68, 69, 56-59, 62, 63 72 12, (b) 68, 69 13, 18, ...
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CE# BWb# NC CE2# BWE CE2 NC BWa# CLK GW ...
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FBGA PIN DESCRIPTIONS x18 x32/x36 SYMBOL 2A, 2B, 3P, 2A, 2B, 3P, 3R, 4P, 4R, 3R, 4P, 4R, 8P, 8R, 9P, 9R, 8P, 8R, 9P, 10A, 10B, 10P, 9R, 10A, 10B, 10R, 11A, 11P, 10P, 10R, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 9A 9A ADV ADSP ADSC MODE (LB0#) (a) 10J, 10K, (a) 10J, 10K, 10L, 10M, 11D, 10L, 10M, 11J, 11E, 11F, 11G 11K, 11L, 11M (b) 1J, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 3C, 3D, 3E, 3C, 3D, 3E, V 3F, 3G, 3J, 3F, 3G, 3J, 3K, 3L, 3M, 3K, 3L, 3M, 3N, 9C, 9D, 3N, 9C, 9D, 9E, 9F, 9G, 9E, 9F, 9G, 9J, 9K, ...
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INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 LINEAR BURST ADDRESS TABLE (MODE = LOW) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS ...
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TRUTH TABLE OPERATION ADDRESS CE# CE2# CE2 Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down Deselected Cycle, Power-Down SNOOZE MODE, Power-Down READ Cycle, Begin Burst READ Cycle, Begin Burst WRITE Cycle, Begin Burst READ Cycle, Begin ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply DD Relative to V .............................. -0.5V to +4.6V SS Voltage Supply DD Relative to V .............................. -0.5V to +4. (DQx) .................................. -0. (inputs) ................................... ...
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I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0°C T 70° +3.3V +0.3V/-0.165V DESCRIPTION Input High (Logic 1) Voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Low ...
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TQFP THERMAL RESISTANCE DESCRIPTION Thermal Resistance Test conditions follow standard test (Junction to Ambient) methods and procedures for measuring thermal impedance, per EIA/JESD51. Thermal Resistance (Junction to Top of Case) FBGA THERMAL RESISTANCE DESCRIPTION Junction to Ambient Test conditions follow ...
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I OPERATING CONDITIONS AND MAXIMUM LIMITS DD (0°C T +70° +3.3V +0.3V/-0.165V +2.5V +0.4V/-0.125V for 2.5V I/O) DESCRIPTION CONDITIONS Power Supply Device selected; All inputs Current: Operating Cycle time ...
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ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Note 1)(0°C T +70° +3.3V +0.3V/-0.165V DESCRIPTION Clock Clock cycle time Clock frequency Clock HIGH time Clock LOW time Output Times Clock to output valid Clock to output invalid ...
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I/O AC TEST CONDITIONS Input pulse levels .................. V .................... V Input rise and fall times ..................................... 1ns Input timing reference levels ...................... V Output reference levels ............................ V Output load ............................. See Figures 1 and ...
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SNOOZE MODE SNOOZE MODE is a low-current, “power-down” mode in which the device is deselected and current is reduced The duration of SNOOZE MODE dictated by the length of time ...
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KC CLK ADSS t ADSH ADSP# ADSC ADDRESS GW#, BWE#, BWa#-BWd# t CES t CEH CE# (NOTE 2) ADV# OE# (NOTE 3) t KQLZ Q ...
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KC CLK ADSS t ADSH ADSP# t ADSS ADSC ADDRESS Byte write signals are ignored for first cycle when ADSP# initiates burst. BWE#, BWa#-BWd# GW# t CES t CEH ...
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KC CLK ADSS t ADSH ADSP# ADSC ADDRESS BWE#, BWa#-BWd# (NOTE 4) t CES t CEH CE# (NOTE 2) ADV# OE High-Z t KQLZ Q ...
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PIN #1 ID 14.00 ±0.10 +0.20 16.00 -0.05 NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.01" per side. 8Mb: 512K x 18, ...
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BALL A11 165X Ø 0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE-REFLOW DIAMETER IS Ø 0.40 7.50 ±0.05 15.00 ±0.10 7.00 ±0.05 5.00 ±0.05 NOTE: 1. All dimensions in millimeters MAX or typical where noted. ...
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REVISION HISTORY Removed “Preliminary Package Data” from front page ........................................................................ February 22/02 Removed -5 speed grade Removed 119-pin PBGA package and references .................................................................................. February 14/02 Removed note "Not Recommended for New Designs," Rev. 6/01 ................................................................. June 7/01 Added industrial temperature ...