7-1926733-7 TE Connectivity, 7-1926733-7 Datasheet
7-1926733-7
Manufacturer Part Number
7-1926733-7
Description
Manufacturer
TE Connectivity
Specifications of 7-1926733-7
Pcb Mount Alignment
Without
Pcb Mount Retention
With
Pcb Mounting Orientation
Right Angle
Make First / Break Last
Yes
Product Line
MINIPAK HDL
Ul File Number
E28476
Termination Method To Pc Board
Through Hole - Press Fit
Sealed
No
Number Of Power Positions
24
Operating Voltage Reference
AC
Operating Voltage (vac)
250
Hot Pluggable
No
Tail Length (mm [in])
3.3 [0.13]
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
8.00 [0.315]
Number Of Signal Positions
40
Number Of Positions
64
Pcb Mount Retention Type
Screw Mount
Selectively Loaded
Yes
Centerline (mm [in])
2.00 [0.079]
Centerline, Power Contacts (mm [in])
2.75 [0.108]
Underplate Material Thickness (µm [?in])
1.27 [50.000]
Length (x-axis) (mm [in])
96.21 [3.790]
Width (z-axis) (mm [in])
36.58 [1.440]
Number Of Rows
1
Mating Retention
Without
Tail Plating Material
Bright Tin-Lead
Contact Type
Socket
Contact Base Material
Copper
Contact Plating, Mating Area, Material
Gold or Palladium Nickel or Performance Based
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Tail Plating, Thickness (µm [?in])
0.5 [20]
Underplate Material
Nickel
Contact Design
Single Beam
Connector Style
Receptacle
Mating Alignment
With
Housing Material
Crystal Polymer
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Mating Alignment Type
Passive Guide
Connector Contact Configuration (no. Of Pos./type)
40/Signal, 24/AC Power
Custom Configurable
No
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Agency/standard
UL, CSA
Ul Rating
Recognized
Ul Voltage Rating (vac)
250
Csa Certified
Yes
Operating Temperature (°c [°f])
-40 – +125 [-40 – +257]
Pcb Thickness, Recommended (mm [in])
1.40 [0.055]
Applies To
Printed Circuit Board
Board-to-board Configuration
Co-Planar
Contact Transmits (typical Application)
Signal (Data)/ Power
Application Use
Board-to-Board
Pick And Place Cover
Without
Packaging Method
Tray
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